H10W 70/611
For connecting multiple chips together
Official title: {for connecting multiple chips together}
H10W70/611 (For connecting multiple chips together) appears on 16,190 US grants and 20,829 published applications in this corpus.
Search patents in H10W- Granted patents
- 16,190
- Published applications
- 20,829
- Assignees
- 1,836
- Inventors
- 19,414
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 9 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 11 | 0 |
| 1981 | 16 | 0 |
| 1982 | 14 | 0 |
| 1983 | 15 | 0 |
| 1984 | 19 | 0 |
| 1985 | 22 | 0 |
| 1986 | 29 | 0 |
| 1987 | 46 | 0 |
| 1988 | 48 | 0 |
| 1989 | 46 | 0 |
| 1990 | 49 | 0 |
| 1991 | 69 | 0 |
| 1992 | 63 | 0 |
| 1993 | 67 | 0 |
| 1994 | 97 | 0 |
| 1995 | 89 | 0 |
| 1996 | 95 | 0 |
| 1997 | 93 | 0 |
| 1998 | 109 | 0 |
| 1999 | 93 | 0 |
| 2000 | 107 | 0 |
| 2001 | 126 | 49 |
| 2002 | 127 | 158 |
| 2003 | 128 | 150 |
| 2004 | 158 | 243 |
| 2005 | 138 | 274 |
| 2006 | 200 | 312 |
| 2007 | 189 | 304 |
| 2008 | 168 | 369 |
| 2009 | 214 | 352 |
| 2010 | 280 | 382 |
| 2011 | 342 | 355 |
| 2012 | 330 | 360 |
| 2013 | 353 | 441 |
| 2014 | 448 | 580 |
| 2015 | 512 | 700 |
| 2016 | 637 | 702 |
| 2017 | 740 | 769 |
| 2018 | 764 | 923 |
| 2019 | 966 | 1234 |
| 2020 | 1078 | 1524 |
| 2021 | 1091 | 1591 |
| 2022 | 1227 | 1692 |
| 2023 | 1264 | 1834 |
| 2024 | 1313 | 2026 |
| 2025 | 1346 | 2093 |
| 2026 | 823 | 1412 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integrated circuit package and method of manufacturing the same6 Oct 2026US 12,754,862 B2SK hynix Inc.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for forming the same8 Oct 2026US 2026/0314394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016