H10W 70/614
The multiple chips being integrally enclosed
Official title: {the multiple chips being integrally enclosed}
H10W70/614 (The multiple chips being integrally enclosed) appears on 7,446 US grants and 9,551 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,446
- Published applications
- 9,551
- Assignees
- 815
- Inventors
- 7,734
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 8 | 0 |
| 1992 | 16 | 0 |
| 1993 | 9 | 0 |
| 1994 | 17 | 0 |
| 1995 | 14 | 0 |
| 1996 | 13 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 10 | 0 |
| 2000 | 17 | 0 |
| 2001 | 20 | 7 |
| 2002 | 29 | 31 |
| 2003 | 33 | 54 |
| 2004 | 48 | 97 |
| 2005 | 54 | 133 |
| 2006 | 81 | 149 |
| 2007 | 87 | 180 |
| 2008 | 75 | 240 |
| 2009 | 116 | 216 |
| 2010 | 171 | 242 |
| 2011 | 224 | 267 |
| 2012 | 223 | 243 |
| 2013 | 223 | 247 |
| 2014 | 259 | 327 |
| 2015 | 280 | 401 |
| 2016 | 357 | 431 |
| 2017 | 446 | 459 |
| 2018 | 467 | 506 |
| 2019 | 554 | 652 |
| 2020 | 572 | 775 |
| 2021 | 561 | 675 |
| 2022 | 551 | 693 |
| 2023 | 525 | 659 |
| 2024 | 535 | 819 |
| 2025 | 537 | 744 |
| 2026 | 270 | 304 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and manufacturing method of semiconductor package6 Oct 2026US 12,757,758 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional device package with carrier substrate and thermal vias29 Sep 2026US 12,751,288 B1Marvel Asia Pte Ltd
- Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs)22 Sep 2026US 12,745,658 B1Eliyan Corporation
- Electronic device15 Sep 2026US 12,740,422 B2Advanced Semiconductor Engineering, Inc.
- High-density interconnect region with mixed bump widths8 Oct 2026US 2026/0314440 A1Intel Corporation
- Multifunctional embedded forming structure for memory packages8 Oct 2026US 2026/0314442 A1SanDisk Technologies LLC
- System-in-package (sip) configured to receive multiple memory dies8 Oct 2026US 2026/0314443 A1QUALCOMM Incorporated
- High-Efficiency Embedded Active Component for Enhanced Channel Loss Compensation1 Oct 2026US 2026/0304790 A1Micron Technology, Inc.
- Semiconductor structure and manufacturing method thereof1 Oct 2026US 2026/0305399 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016