Multifunctional embedded forming structure for memory packages

Abstract

Examples described herein provide multifunctional embedded forming structures substrate for memory packages. In one example, an embedded forming structure includes a substrate defining a cavity. The substrate is formed using multi-layer forming such that the substrate includes a plurality of layers. Electrical components, such as resistors, capacitors, and inductors may be embedded within the layers during forming of the substrate. Through vias may also be formed in the substrate. The substrate defines a cavity that receives a die, such as a memory die. A supporting structure is formed between the die and the substrate. Electrical interconnects may be formed in the supporting structure that electrically connect the die and the substrate.

Dependencies are inferred from the claim text.