Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs)

A memory device, comprising:

• a logic integrated circuit (IC) chip device comprising:
• a first substrate comprising traces that are of a first connection density;
• a first chiplet formed via a first IC manufacturing process and coupled to the traces of the first substrate;
• a second chiplet formed via a second IC manufacturing process that is different than the first IC manufacturing process, the second chiplet comprising a first interface that is coupled to the first chiplet via the traces of the first substrate, the second chiplet comprising a second interface that exhibits a second connection density that is lower than the first connection density;
• at least one memory IC die stacked with the logic IC chip device;
• and
• external interface circuitry comprising a first number of signaling paths for the at least one memory IC die to communicate with the logic IC chip device.

An integrated circuit (IC) chip device, comprising:

• a first substrate to mount to a main substrate, the first substrate comprising traces that are of a first connection density;
• a first chiplet formed via a first IC manufacturing process and coupled to the traces of the first substrate;
• a second chiplet formed via a second IC manufacturing process that is different than the first IC manufacturing process, the second chiplet comprising a first interface that is coupled to the first chiplet via the traces of the first substrate, the second chiplet comprising a second interface that exhibits a second connection density that is lower than the first connection density, the second interface to couple to a second IC chip device that is mounted to th main substrate;
• and
• external interface circuitry comprising a first number of signaling paths for the IC chip device to communicate with the second IC chip device.