H10W 46/501
Marks applied to devices: for use before dicing
Official title: {for use before dicing}
H10W46/501 (Marks applied to devices: for use before dicing) appears on 2,282 US grants and 2,275 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,282
- Published applications
- 2,275
- Assignees
- 467
- Inventors
- 4,316
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 7 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 2 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 8 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 13 | 0 |
| 1995 | 10 | 0 |
| 1996 | 21 | 0 |
| 1997 | 25 | 0 |
| 1998 | 26 | 0 |
| 1999 | 61 | 0 |
| 2000 | 54 | 0 |
| 2001 | 61 | 29 |
| 2002 | 69 | 67 |
| 2003 | 77 | 73 |
| 2004 | 85 | 81 |
| 2005 | 58 | 89 |
| 2006 | 55 | 89 |
| 2007 | 56 | 101 |
| 2008 | 50 | 79 |
| 2009 | 65 | 70 |
| 2010 | 58 | 53 |
| 2011 | 56 | 57 |
| 2012 | 53 | 40 |
| 2013 | 64 | 69 |
| 2014 | 54 | 78 |
| 2015 | 90 | 106 |
| 2016 | 103 | 126 |
| 2017 | 122 | 172 |
| 2018 | 144 | 107 |
| 2019 | 100 | 118 |
| 2020 | 106 | 116 |
| 2021 | 93 | 112 |
| 2022 | 86 | 105 |
| 2023 | 89 | 115 |
| 2024 | 80 | 91 |
| 2025 | 83 | 88 |
| 2026 | 37 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Memory device package having scribe line and method for manufacturing the same6 Oct 2026US 12,757,742 B2Nanya Technology Corporation
- Memory device package having scribe line and method for manufacturing the same15 Sep 2026US 12,740,432 B2Nanya Technology Corporation
- Integrated circuitry, memory circuitry comprising strings of memory cells, and methods used in forming integrated circuitry1 Sep 2026US 12,725,656 B2Micron Technology, Inc.
- Method of manufacturing silicon carbide substrate, silicon carbide single-crystal substrate and silicon carbide semiconductor device25 Aug 2026US 12,720,830 B2Denso Corporation
- Method for aligning backside pattern based on one or more frontside alignment marks of a semiconductor wafer25 Aug 2026US 12,721,184 B2Alpha and Omega Semiconductor International LP
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314430 A1SK hynix Inc.
- Semiconductor device and method for fabricating the same24 Sep 2026US 2026/0293124 A1SK hynix Inc.
- Method for manufacturing semiconductor device24 Sep 2026US 2026/0293564 A1Kabushiki Kaisha Toshiba
- Semiconductor device24 Sep 2026US 2026/0293681 A1SK hynix Inc.
Most cited
By later US patents
- Vertical gate all around (VGAA) devices and methods of manufacturing the same987US 9,536,738 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Process for manufacturing three dimensional IC's337US 5,266,511 AFujitsu Limited · 1993
- Integrated circuit on corrugated substrate310US 7,190,050 B2Synopsys, Inc. · 2007
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Alignment techniques for epitaxial growth processes288US 6,294,018 B1Lucent Technologies Inc. · 2001