H10W 46/503
Located in scribe lines
Official title: {Located in scribe lines}
H10W46/503 (Located in scribe lines) appears on 826 US grants and 999 published applications in this corpus.
Search patents in H10W- Granted patents
- 826
- Published applications
- 999
- Assignees
- 187
- Inventors
- 1,796
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 11 | 4 |
| 2002 | 9 | 4 |
| 2003 | 5 | 11 |
| 2004 | 7 | 12 |
| 2005 | 9 | 18 |
| 2006 | 7 | 14 |
| 2007 | 15 | 30 |
| 2008 | 5 | 20 |
| 2009 | 13 | 24 |
| 2010 | 18 | 17 |
| 2011 | 17 | 18 |
| 2012 | 15 | 9 |
| 2013 | 22 | 28 |
| 2014 | 22 | 38 |
| 2015 | 45 | 62 |
| 2016 | 54 | 65 |
| 2017 | 70 | 109 |
| 2018 | 91 | 60 |
| 2019 | 54 | 64 |
| 2020 | 71 | 78 |
| 2021 | 59 | 68 |
| 2022 | 49 | 45 |
| 2023 | 44 | 57 |
| 2024 | 35 | 53 |
| 2025 | 41 | 60 |
| 2026 | 21 | 31 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Memory device package having scribe line and method for manufacturing the same6 Oct 2026US 12,757,742 B2Nanya Technology Corporation
- Memory device package having scribe line and method for manufacturing the same15 Sep 2026US 12,740,432 B2Nanya Technology Corporation
- Integrated circuitry, memory circuitry comprising strings of memory cells, and methods used in forming integrated circuitry1 Sep 2026US 12,725,656 B2Micron Technology, Inc.
- Semiconductor structure, dicing method thereof, and memory11 Aug 2026US 12,707,985 B2Yangtze Memory Technologies Co., Ltd.
- Semiconductor device and semiconductor chip4 Aug 2026US 12,702,017 B2Samsung Electronics Co., Ltd.
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314430 A1SK hynix Inc.
- Semiconductor device and method for fabricating the same24 Sep 2026US 2026/0293124 A1SK hynix Inc.
- Semiconductor device24 Sep 2026US 2026/0293681 A1SK hynix Inc.
- Alignment Structure for Image Sensor24 Sep 2026US 2026/0293697 A1OmniVision Technologies, Inc.
Most cited
By later US patents
- Integrated circuit on corrugated substrate310US 7,190,050 B2Synopsys, Inc. · 2007
- Integrated circuit on corrugated substrate274US 7,528,465 B2Synopsys, Inc. · 2009
- Method of reducing residual contamination in singulated semiconductor die237US 10,026,605 B2Semiconductor Components Industries, LLC · 2018
- Methods of designing an integrated circuit on corrugated substrate139US 7,960,232 B2Synopsys, Inc. · 2011
- Substrate dividing method138US 7,566,635 B2Hamamatsu Photonics K.K. · 2009