H10W 20/423
Shielding layers
Official title: {Shielding layers}
H10W20/423 (Shielding layers) appears on 965 US grants and 1,086 published applications in this corpus.
Search patents in H10W- Granted patents
- 965
- Published applications
- 1,086
- Assignees
- 268
- Inventors
- 1,714
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 10 | 3 |
| 2002 | 13 | 17 |
| 2003 | 20 | 41 |
| 2004 | 21 | 23 |
| 2005 | 38 | 44 |
| 2006 | 26 | 33 |
| 2007 | 12 | 82 |
| 2008 | 43 | 34 |
| 2009 | 24 | 41 |
| 2010 | 26 | 38 |
| 2011 | 31 | 32 |
| 2012 | 38 | 37 |
| 2013 | 46 | 35 |
| 2014 | 54 | 52 |
| 2015 | 50 | 52 |
| 2016 | 49 | 38 |
| 2017 | 50 | 42 |
| 2018 | 39 | 52 |
| 2019 | 44 | 40 |
| 2020 | 51 | 52 |
| 2021 | 44 | 61 |
| 2022 | 41 | 50 |
| 2023 | 43 | 57 |
| 2024 | 45 | 47 |
| 2025 | 45 | 50 |
| 2026 | 19 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Capacitive element and semiconductor device6 Oct 2026US 12,757,714 B2Ablic Inc.
- Semiconductor device including different conductive lines15 Sep 2026US 12,740,053 B2Samsung Electronics Co., Ltd.
- Inductor performance enhancement using an outer, peripheral patterned ground shield8 Sep 2026US 12,733,486 B2QUALCOMM Incorporated
- Integrated circuit package and medical device including same11 Aug 2026US 12,707,980 B2Medtronic, Inc.
- Integrated isolation capacitor with enhanced bottom plate4 Aug 2026US 12,701,991 B2Texas Instruments Incorporated
- Electrical interconnects for packages containing photonic integrated circuits1 Oct 2026US 2026/0305479 A1Sicily Merger Sub II, Inc.
- Semiconductor device and manufacturing method thereof17 Sep 2026US 2026/0282370 A1Kioxia Corporation
- Semiconductor memory device13 Aug 2026US 2026/0239613 A1Samsung Electronics Co., Ltd.
- Electronic component23 Jul 2026US 2026/0213063 A1Rohm Co., Ltd.
- Integrated circuit structure2 Jul 2026US 2026/0191010 A1Mediatek Inc.
Most cited
By later US patents
- Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias532US 5,414,221 AIntel Corporation · 1995
- Stacked IC structure with system level wiring on multiple sides of the IC die164US 10,950,547 B2Xcelsis Corporation · 2021
- Flip chip circuit arrangement with redistribution layer that minimizes crosstalk160US 5,994,766 AVLSI Technology, Inc. · 1999
- High performance interconnect system for an integrated circuit132US 5,117,276 AFairchild Camera and Instrument Corporation · 1992
- Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise121US 6,501,169 B1Casio Computer Co., Ltd. · 2002