Integrated circuit package and medical device including same

A medical device comprising a housing and circuitry disposed within the housing, wherein the circuitry comprises an integrated circuit package comprising:

• an integrated circuit comprising a first major surface, a second major surface, and an integrated circuit contact disposed on the first major surface;
• a first passivation layer separate from the integrated circuit and disposed on the first major surface of the integrated circuit and over the integrated circuit contact;
• a redistribution layer disposed on the first passivation layer, wherein the redistribution layer comprises a conductive trace and a shield region, wherein the conductive trace and the shield region define a plane of the redistribution layer;
• a second passivation layer disposed on the redistribution layer;
• and
• a patterned conductive layer disposed on the second passivation layer and comprising a conductive trace, wherein a portion of the shield region of the redistribution layer is disposed between the conductive trace of the patterned conductive layer and the integrated circuit along an axis that is substantially orthogonal to the first major surface of the integrated circuit.

An integrated circuit package that incorporates an integrated circuit with a plurality of layers, wherein the integrated circuit comprises a first major surface, a second major surface, and an integrated circuit contact disposed on the first major surface, and further wherein the plurality of layers comprises:

• a first passivation layer disposed on the first major surface of the integrated circuit and over the integrated circuit contact;
• a redistribution layer disposed on the first passivation layer, wherein the redistribution layer comprises a conductive trace and a shield region, wherein the conductive trace and the shield region define a plane of the redistribution layer;
• a second passivation layer disposed on the redistribution layer;
• and
• a patterned conductive layer disposed on the second passivation layer and comprising a conductive trace, wherein a portion of the shield region of the redistribution layer is disposed between the conductive trace of the patterned conductive layer and the integrated circuit along an axis that is substantially orthogonal to the first major surface of the integrated circuit.