H10W 20/086
Involving buried masks
Official title: {involving buried masks}
H10W20/086 (Involving buried masks) appears on 519 US grants and 443 published applications in this corpus.
Search patents in H10W- Granted patents
- 519
- Published applications
- 443
- Assignees
- 124
- Inventors
- 887
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 28 | 0 |
| 2001 | 45 | 18 |
| 2002 | 37 | 34 |
| 2003 | 42 | 43 |
| 2004 | 34 | 34 |
| 2005 | 24 | 35 |
| 2006 | 34 | 27 |
| 2007 | 19 | 21 |
| 2008 | 15 | 9 |
| 2009 | 10 | 13 |
| 2010 | 16 | 5 |
| 2011 | 6 | 13 |
| 2012 | 5 | 15 |
| 2013 | 10 | 4 |
| 2014 | 8 | 13 |
| 2015 | 12 | 19 |
| 2016 | 28 | 24 |
| 2017 | 21 | 19 |
| 2018 | 17 | 15 |
| 2019 | 21 | 14 |
| 2020 | 15 | 17 |
| 2021 | 13 | 15 |
| 2022 | 5 | 9 |
| 2023 | 9 | 11 |
| 2024 | 12 | 9 |
| 2025 | 9 | 4 |
| 2026 | 5 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for creating interconnections25 Jun 2026US 2026/0181786 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Semiconductor devices and methods of manufacture25 Jun 2026US 2026/0182415 A1
- Method of overlay measurement7 May 2026US 2026/0130202 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Dual damascene structure in forming source/drain contacts7 Aug 2025US 2025/0254956 A1Taiwan Semiconductor Manufacturing Company.Ltd
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By later US patents
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- High-density plasma etching of carbon-based low-k materials in a integrated circuit458US 6,284,149 B1APPLIED Materials.Inc. · 2001