H10W 20/076
In via holes or trenches
Official title: {in via holes or trenches}
H10W20/076 (In via holes or trenches) appears on 4,710 US grants and 5,349 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,710
- Published applications
- 5,349
- Assignees
- 449
- Inventors
- 6,652
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 17 | 0 |
| 1998 | 30 | 0 |
| 1999 | 35 | 0 |
| 2000 | 76 | 0 |
| 2001 | 105 | 39 |
| 2002 | 119 | 126 |
| 2003 | 93 | 94 |
| 2004 | 114 | 139 |
| 2005 | 84 | 131 |
| 2006 | 107 | 129 |
| 2007 | 78 | 140 |
| 2008 | 71 | 120 |
| 2009 | 84 | 122 |
| 2010 | 99 | 98 |
| 2011 | 106 | 102 |
| 2012 | 102 | 115 |
| 2013 | 105 | 117 |
| 2014 | 127 | 164 |
| 2015 | 160 | 230 |
| 2016 | 255 | 268 |
| 2017 | 291 | 277 |
| 2018 | 244 | 245 |
| 2019 | 264 | 277 |
| 2020 | 299 | 351 |
| 2021 | 290 | 365 |
| 2022 | 265 | 416 |
| 2023 | 271 | 391 |
| 2024 | 288 | 391 |
| 2025 | 330 | 335 |
| 2026 | 154 | 167 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor memory device manufacturing method6 Oct 2026US 12,757,699 B2Nanya Technology Corporation
- Semiconductor structure and method of manufacturing the same6 Oct 2026US 12,757,723 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating semiconductor device29 Sep 2026US 12,751,222 B2Samsung Electronics Co., Ltd.
- Connecting structure comprising isolation between connecting vias and method for forming the same29 Sep 2026US 12,751,269 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Diffusion barrier for semiconductor device and method29 Sep 2026US 12,751,270 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Low resistance interconnect features and method for manufacturing the same8 Oct 2026US 2026/0314352 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method thereof8 Oct 2026US 2026/0314356 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Via structure and method for forming the same8 Oct 2026US 2026/0314367 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Forming multiple tsvs with different formation schemes8 Oct 2026US 2026/0314368 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hybrid method for forming semiconductor interconnect structure8 Oct 2026US 2026/0314370 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices775US 7,157,787 B2Intel Corporation · 2007
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Selective electroless copper deposited interconnect plugs for ULSI applications638US 5,674,787 ASematech, Inc. · 1997