H10P 72/0412
Using mainly scrubbing means
Official title: {using mainly scrubbing means, e.g. brushes}
H10P72/0412 (Using mainly scrubbing means) appears on 802 US grants and 883 published applications in this corpus.
Search patents in H10P- Granted patents
- 802
- Published applications
- 883
- Assignees
- 199
- Inventors
- 1,592
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 7 | 0 |
| 1998 | 15 | 0 |
| 1999 | 34 | 0 |
| 2000 | 31 | 0 |
| 2001 | 41 | 20 |
| 2002 | 41 | 52 |
| 2003 | 53 | 29 |
| 2004 | 31 | 34 |
| 2005 | 23 | 28 |
| 2006 | 16 | 24 |
| 2007 | 14 | 36 |
| 2008 | 12 | 24 |
| 2009 | 7 | 36 |
| 2010 | 14 | 15 |
| 2011 | 15 | 17 |
| 2012 | 16 | 20 |
| 2013 | 15 | 32 |
| 2014 | 17 | 38 |
| 2015 | 16 | 37 |
| 2016 | 19 | 29 |
| 2017 | 34 | 39 |
| 2018 | 26 | 35 |
| 2019 | 37 | 40 |
| 2020 | 44 | 42 |
| 2021 | 27 | 44 |
| 2022 | 26 | 45 |
| 2023 | 44 | 47 |
| 2024 | 38 | 54 |
| 2025 | 37 | 43 |
| 2026 | 32 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus of cleaning substrate, apparatus of semiconductor device and method for manufacturing a semiconductor package using the same8 Sep 2026US 12,733,427 B2Samsung Electronics Co., Ltd.
- System and method for cleaning a wafer surface18 Aug 2026US 12,713,876 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing method and substrate processing apparatus11 Aug 2026US 12,703,013 B2SCREEN Holdings Co., Ltd.
- Brush assembly and wafer cleaning device including the same11 Aug 2026US 12,707,916 B2Samsung Electronics Co., Ltd.
- Method of cleaning a nozzle11 Aug 2026US 12,707,929 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing device24 Sep 2026US 2026/0283341 A1SCREEN Holdings Co., Ltd.
- Chuck pin, substrate holding device, and substrate processing device17 Sep 2026US 2026/0282838 A1SCREEN Holdings Co., Ltd.
- Brush nodule with ribbed surface20 Aug 2026US 2026/0241420 A1Tcnv, LLC
- Substrate cleaning device and substrate cleaning method20 Aug 2026US 2026/0247898 A1SCREEN Holdings Co., Ltd.
- Brush cleaning apparatus6 Aug 2026US 2026/0224020 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Die processing235US 10,269,756 B2Invensas Bonding Technologies, Inc. · 2019
- Die processing162US 10,985,133 B2Invensas Bonding Technologies, Inc. · 2021
- Double-sided substrate cleaning apparatus160US 5,518,542 ATokyo Electron Kyushu Limited · 1996
- Cleaning apparatus for cleaning reverse surface of semiconductor wafer109US 5,361,449 ATokyo Electron Kyushu Limited · 1994
- Mechanical scrubbing for particle removal87US 5,551,986 ATaxas Instruments Incorporated · 1996