Substrate cleaning device and substrate cleaning method

Abstract

A substrate cleaning device includes a spin chuck, a liquid supply mechanism, a brush pressing mechanism and a brush. The spin chuck rotates a substrate while holding the substrate. The liquid supply mechanism supplies a cleaning liquid onto one surface of the substrate held and rotated by the spin chuck. The brush pressing mechanism presses the brush against the one surface of the rotating substrate during a predetermined pressing period. The liquid supply mechanism supplies the cleaning liquid onto the one surface of the substrate at a predetermined reference flow rate before the pressing period. Further, the liquid supply mechanism supplies the cleaning liquid onto the one surface of the substrate at a flow rate smaller than the reference flow rate or stops supplying the cleaning liquid during at least part of the pressing period.

Dependencies are inferred from the claim text.