Double-sided substrate cleaning apparatus
AssigneesTokyo Electron Limited, Tokyo Electron Kyushu Limited
InventorsHiroyuki Matsukawa, Akira Yonemizu, Michiaki Matsushita, Akihiro Fujimoto, Takashi Takekuma, Hidetami Yaegashi, Takahide Fukuda
Life of this patent
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Abstract
There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.
Claims23
A double-sided substrate cleaning apparatus, comprising:
- a carrier station for loading and unloading a carrier in which a semiconductor wafer having an orientation flat is stored;
- a convey mechanism for conveying the semiconductor wafer taken out from said carrier station;
- at least one cleaning mechanism, arranged along a convey path on which said convey mechanism conveys the semiconductor wafer, for cleaning the semiconductor wafer;
- a reversing mechanism, arranged along the convey path, for inverting the semiconductor wafer;
- wherein said reversing mechanism includes an orientation flat alignment mechanism for aligning a position of said orientation flat;
- and
- wherein said orientation flat alignment mechanism includes means for rotating the semiconductor wafer while the semiconductor wafer is placed thereon, and detecting means for detecting said orientation flat.
A resist process apparatus, comprising:
- a carrier station for loading and unloading a carrier in which a semiconductor wafer having an orientation flat is stored;
- a convey mechanism for conveying the semiconductor wafer taken out from said carrier station;
- at least one cleaning mechanism, arranged along a convey path on which said convey mechanism conveys the semiconductor wafer, for cleaning the object;
- a reversing mechanism, arranged along the convey path, for inverting the semiconductor wafer;
- a coating mechanism, arranged along the convey path, for coating a resist solution on the semiconductor wafer;
- a drying mechanism, arranged along the convey path, for drying the coated resist solution to form a coating film on the semiconductor wafers;
- an exposure mechanism, arranged along the convey path, for exposing the coating film form on the semiconductor wafer;
- a development mechanism, arranged along the convey path, for developing the coating film after exposure;
- wherein said reversing mechanism includes an orientation flat alignment mechanism for aligning a position of said orientation flat;
- and
- wherein said orientation flat alignment mechanism includes means for rotating the semiconductor wafer while the semiconductor wafer is placed thereon, and detecting means for detecting said orientation flat.
Dependencies are inferred from the claim text.