H10P 72/0402
Apparatus for fluid treatment
Official title: {Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence)}
H10P72/0402 (Apparatus for fluid treatment) appears on 12,897 US grants and 16,006 published applications in this corpus.
Search patents in H10P- Granted patents
- 12,897
- Published applications
- 16,006
- Assignees
- 1,913
- Inventors
- 21,825
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 7 | 0 |
| 1984 | 7 | 0 |
| 1985 | 14 | 0 |
| 1986 | 7 | 0 |
| 1987 | 19 | 0 |
| 1988 | 28 | 0 |
| 1989 | 38 | 0 |
| 1990 | 59 | 0 |
| 1991 | 55 | 0 |
| 1992 | 64 | 0 |
| 1993 | 104 | 0 |
| 1994 | 110 | 0 |
| 1995 | 77 | 0 |
| 1996 | 77 | 0 |
| 1997 | 85 | 0 |
| 1998 | 152 | 0 |
| 1999 | 282 | 0 |
| 2000 | 325 | 0 |
| 2001 | 363 | 190 |
| 2002 | 383 | 453 |
| 2003 | 394 | 446 |
| 2004 | 343 | 580 |
| 2005 | 280 | 488 |
| 2006 | 238 | 498 |
| 2007 | 229 | 510 |
| 2008 | 197 | 539 |
| 2009 | 190 | 467 |
| 2010 | 244 | 364 |
| 2011 | 301 | 360 |
| 2012 | 299 | 415 |
| 2013 | 312 | 462 |
| 2014 | 367 | 555 |
| 2015 | 384 | 617 |
| 2016 | 389 | 510 |
| 2017 | 445 | 676 |
| 2018 | 497 | 831 |
| 2019 | 605 | 912 |
| 2020 | 779 | 988 |
| 2021 | 711 | 951 |
| 2022 | 677 | 913 |
| 2023 | 698 | 946 |
| 2024 | 723 | 869 |
| 2025 | 745 | 811 |
| 2026 | 564 | 655 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate processing system6 Oct 2026US 12,752,315 B2SCREEN Holdings Co., Ltd.
- Flow control arrangements, semiconductor processing systems having flow control arrangements, and flow control methods6 Oct 2026US 12,753,499 B2ASM IP Holding B. V.
- Baffle inspection apparatus6 Oct 2026US 12,754,090 B2Samsung Electronics Co., Ltd.
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Plasma processing apparatus and gas exhaust method6 Oct 2026US 12,755,945 B2Hitachi High-Tech Corporation
- Bowl assembly and substrate processing apparatus comprising the same8 Oct 2026US 2026/0307119 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0307120 A1Tokyo Electron Limited
- Semiconductor process system and method of cleaning the same8 Oct 2026US 2026/0308756 A1Samsung Electronics Co., Ltd.
- Diaphragm pump8 Oct 2026US 2026/0309142 A1Ckd Corporation
- Dehumidifying module, wafer processing apparatus8 Oct 2026US 2026/0309414 A1Ebara Corporation
Most cited
By later US patents
- Plasma cleaning method for removing residues in a plasma treatment chamber842US 5,356,478 ALam Research Corporation · 1994
- Lid assembly for a processing system to facilitate sequential deposition techniques697US 6,878,206 B2APPLIED Materials.Inc. · 2005
- Temperature control system for semiconductor process chamber652US 6,015,465 AAPPLIED Materials.Inc. · 2000
- Modular architecture for semiconductor wafer fabrication equipment638US 6,312,525 B1APPLIED Materials.Inc. · 2001
- Plasma processing apparatus634US 6,162,323 AJapan Science and Technology Corporation · 2000