H10P 72/0418
For etching
Official title: {for etching}
H10P72/0418 (For etching) appears on 5,181 US grants and 6,750 published applications in this corpus.
Search patents in H10P- Granted patents
- 5,181
- Published applications
- 6,750
- Assignees
- 934
- Inventors
- 10,305
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 11 | 0 |
| 1990 | 18 | 0 |
| 1991 | 12 | 0 |
| 1992 | 12 | 0 |
| 1993 | 28 | 0 |
| 1994 | 33 | 0 |
| 1995 | 24 | 0 |
| 1996 | 17 | 0 |
| 1997 | 9 | 0 |
| 1998 | 29 | 0 |
| 1999 | 72 | 0 |
| 2000 | 77 | 0 |
| 2001 | 108 | 57 |
| 2002 | 109 | 150 |
| 2003 | 125 | 162 |
| 2004 | 135 | 243 |
| 2005 | 94 | 231 |
| 2006 | 87 | 185 |
| 2007 | 101 | 216 |
| 2008 | 84 | 254 |
| 2009 | 84 | 184 |
| 2010 | 109 | 174 |
| 2011 | 134 | 155 |
| 2012 | 127 | 152 |
| 2013 | 146 | 174 |
| 2014 | 180 | 257 |
| 2015 | 187 | 291 |
| 2016 | 200 | 262 |
| 2017 | 198 | 348 |
| 2018 | 243 | 410 |
| 2019 | 312 | 430 |
| 2020 | 368 | 460 |
| 2021 | 333 | 455 |
| 2022 | 311 | 352 |
| 2023 | 275 | 347 |
| 2024 | 271 | 294 |
| 2025 | 286 | 268 |
| 2026 | 194 | 239 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Baffle inspection apparatus6 Oct 2026US 12,754,090 B2Samsung Electronics Co., Ltd.
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Semiconductor processing preclean methods and apparatus6 Oct 2026US 12,757,665 B2ASM IP Holding B. V.
- Plasma processing device and plasma processing method6 Oct 2026US 12,757,669 B2Hitachi High-Tech Corporation
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus8 Oct 2026US 2026/0314297 A1Kokusai Electric Corporation
- Prediction device and etching control system8 Oct 2026US 2026/0314298 A1Tokyo Electron Limited
- Auxiliary ring in substrate processing apparatus8 Oct 2026US 2026/0314327 A1Samsung Electronics Co., Ltd.
- Etching method and etching apparatus1 Oct 2026US 2026/0305203 A1Hitachi High-Tech Corporation
- Systems and methods for etching a high aspect ratio structure1 Oct 2026US 2026/0305206 A1Lam Research Corporation
Most cited
By later US patents
- Plasma processing apparatus634US 6,162,323 AJapan Science and Technology Corporation · 2000
- Methods and apparatus for atomic layer etching577US 8,617,411 B2Lam Research Corporation · 2013
- Shower head and plasma processing apparatus having same552US 8,282,769 B2Tokyo Electron Limited · 2012
- Adsorption based material removal process539US 8,043,972 B1Novellus Systems, Inc. · 2011
- Semiconductor reaction chamber with plasma capabilities538US 9,018,111 B2ASM IP Holding B. V. · 2015