H10P 72/0422
For wet etching
Official title: {for wet etching}
H10P72/0422 (For wet etching) appears on 2,048 US grants and 2,711 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,048
- Published applications
- 2,711
- Assignees
- 549
- Inventors
- 4,437
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 12 | 0 |
| 1994 | 14 | 0 |
| 1995 | 11 | 0 |
| 1996 | 8 | 0 |
| 1997 | 3 | 0 |
| 1998 | 12 | 0 |
| 1999 | 35 | 0 |
| 2000 | 33 | 0 |
| 2001 | 56 | 26 |
| 2002 | 55 | 83 |
| 2003 | 64 | 88 |
| 2004 | 72 | 105 |
| 2005 | 38 | 105 |
| 2006 | 37 | 69 |
| 2007 | 53 | 106 |
| 2008 | 35 | 117 |
| 2009 | 35 | 81 |
| 2010 | 42 | 75 |
| 2011 | 62 | 65 |
| 2012 | 51 | 79 |
| 2013 | 66 | 83 |
| 2014 | 78 | 109 |
| 2015 | 66 | 121 |
| 2016 | 73 | 111 |
| 2017 | 83 | 117 |
| 2018 | 87 | 146 |
| 2019 | 114 | 111 |
| 2020 | 113 | 141 |
| 2021 | 107 | 137 |
| 2022 | 94 | 134 |
| 2023 | 98 | 153 |
| 2024 | 110 | 131 |
| 2025 | 125 | 122 |
| 2026 | 90 | 96 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Baffle inspection apparatus6 Oct 2026US 12,754,090 B2Samsung Electronics Co., Ltd.
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Module kit for a chemical and/or electrolytic surface treatment of a substrate22 Sep 2026US 12,742,252 B2Lam Research Salzburg GmbH
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Methods to improve etch uniformity across a semiconductor substrate when etching with a hydrofluoric acid (HF) and nitric acid (HNO3) solution1 Sep 2026US 12,727,411 B2Tokyo Electron Limited
- Prediction device and etching control system8 Oct 2026US 2026/0314298 A1Tokyo Electron Limited
- Apparatus and method for processing substrate24 Sep 2026US 2026/0293576 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus, processing liquid supply device, substrate processing method and processing liquid supply method17 Sep 2026US 2026/0282798 A1SCREEN Holdings Co., Ltd.
- Method of processing substrate and substrate processing apparatus17 Sep 2026US 2026/0282799 A1SCREEN Holdings Co., Ltd.
- Substrate processing method10 Sep 2026US 2026/0271644 A1Tokyo Electron Limited
Most cited
By later US patents
- Adsorption based material removal process539US 8,043,972 B1Novellus Systems, Inc. · 2011
- Semiconductor device manufacturing system534US 6,212,789 B1Canon Sales Co., Inc. · 2001
- Substrate treatment method and substrate treatment apparatus473US 9,698,031 B2SCREEN Holdings Co., Ltd. · 2017
- Etchant mixing system for edge bevel removal of copper from silicon wafers407US 6,333,275 B1Novellus Systems, Inc. · 2001
- Low temperature system and method for CVD copper removal383US 5,897,379 ASharp Kabushiki Kaisha · 1999