H10P 72/0424
Using mainly spraying means
Official title: {using mainly spraying means, e.g. nozzles}
H10P72/0424 (Using mainly spraying means) appears on 1,345 US grants and 1,841 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,345
- Published applications
- 1,841
- Assignees
- 332
- Inventors
- 2,947
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 18 | 0 |
| 2000 | 12 | 0 |
| 2001 | 32 | 21 |
| 2002 | 37 | 52 |
| 2003 | 43 | 57 |
| 2004 | 48 | 74 |
| 2005 | 22 | 67 |
| 2006 | 28 | 48 |
| 2007 | 29 | 78 |
| 2008 | 28 | 78 |
| 2009 | 25 | 59 |
| 2010 | 29 | 52 |
| 2011 | 47 | 45 |
| 2012 | 34 | 62 |
| 2013 | 48 | 55 |
| 2014 | 58 | 76 |
| 2015 | 44 | 79 |
| 2016 | 51 | 73 |
| 2017 | 62 | 77 |
| 2018 | 54 | 102 |
| 2019 | 71 | 57 |
| 2020 | 73 | 95 |
| 2021 | 64 | 98 |
| 2022 | 57 | 88 |
| 2023 | 71 | 121 |
| 2024 | 76 | 94 |
| 2025 | 92 | 76 |
| 2026 | 66 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Module kit for a chemical and/or electrolytic surface treatment of a substrate22 Sep 2026US 12,742,252 B2Lam Research Salzburg GmbH
- Method for manufacturing printed circuit boards1 Sep 2026US 12,727,090 B2Gebr. Schmid GmbH & Co.
- Methods to improve etch uniformity across a semiconductor substrate when etching with a hydrofluoric acid (HF) and nitric acid (HNO3) solution1 Sep 2026US 12,727,411 B2Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus25 Aug 2026US 12,721,079 B2Tokyo Electron Limited
- Prediction device and etching control system8 Oct 2026US 2026/0314298 A1Tokyo Electron Limited
- Apparatus and method for processing substrate24 Sep 2026US 2026/0293576 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus, processing liquid supply device, substrate processing method and processing liquid supply method17 Sep 2026US 2026/0282798 A1SCREEN Holdings Co., Ltd.
- Method of processing substrate and substrate processing apparatus17 Sep 2026US 2026/0282799 A1SCREEN Holdings Co., Ltd.
- Substrate processing method10 Sep 2026US 2026/0271644 A1Tokyo Electron Limited
Most cited
By later US patents
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- Low temperature system and method for CVD copper removal383US 5,897,379 ASharp Kabushiki Kaisha · 1999
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001
- Adsorption based material removal process322US 7,416,989 B1Novellus Systems, Inc. · 2008