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US 2026/0282799 A1Published application
Method of processing substrate and substrate processing apparatus
AssigneeSCREEN Holdings Co., Ltd.
InventorYuta NISHIMURA
Life of this patent
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Abstract
A method of processing a substrate includes: holding the substrate; and dispensing a processing liquid from a plurality of outlets of an elongated nozzle toward a main surface of the substrate while the substrate is rotated and the elongated nozzle is moved along a longitudinal direction, the elongated nozzle extending along the longitudinal direction, the plurality of outlets being aligned along the longitudinal direction.
Claims8
A method of processing a substrate, the method comprising:
- holding the substrate;
- and
- dispensing a processing liquid from a plurality of outlets of an elongated nozzle toward a main surface of the substrate while the substrate is rotated and the elongated nozzle is moved along a longitudinal direction, the elongated nozzle extending along the longitudinal direction, the plurality of outlets being aligned along the longitudinal direction.
A substrate processing apparatus, comprising:
- a substrate holder that rotates a substrate while holding the substrate;
- a dispenser including an elongated nozzle including a plurality of outlets, the dispenser dispensing a processing liquid from the plurality of outlets toward a main surface of the substrate, the plurality of outlets being aligned along a longitudinal direction of the elongated nozzle;
- and
- a first movement driver that moves the elongated nozzle along the longitudinal direction.
1 more element
Dependencies are inferred from the claim text.