H10P 72/0426
With the semiconductor substrates being dipped in baths or vessels
Official title: {with the semiconductor substrates being dipped in baths or vessels}
H10P72/0426 (With the semiconductor substrates being dipped in baths or vessels) appears on 622 US grants and 773 published applications in this corpus.
Search patents in H10P- Granted patents
- 622
- Published applications
- 773
- Assignees
- 272
- Inventors
- 1,597
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 22 | 0 |
| 2000 | 19 | 0 |
| 2001 | 24 | 8 |
| 2002 | 20 | 33 |
| 2003 | 24 | 31 |
| 2004 | 23 | 32 |
| 2005 | 16 | 41 |
| 2006 | 10 | 21 |
| 2007 | 20 | 26 |
| 2008 | 6 | 33 |
| 2009 | 5 | 26 |
| 2010 | 10 | 25 |
| 2011 | 13 | 18 |
| 2012 | 21 | 24 |
| 2013 | 19 | 28 |
| 2014 | 18 | 24 |
| 2015 | 18 | 30 |
| 2016 | 15 | 26 |
| 2017 | 22 | 30 |
| 2018 | 26 | 45 |
| 2019 | 29 | 33 |
| 2020 | 24 | 42 |
| 2021 | 32 | 32 |
| 2022 | 29 | 33 |
| 2023 | 27 | 31 |
| 2024 | 24 | 25 |
| 2025 | 29 | 41 |
| 2026 | 24 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus and substrate processing method18 Aug 2026US 12,713,865 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method28 Jul 2026US 12,696,712 B2Kioxia Corporation
- Substrate processing apparatus and method for manufacturing semiconductor device21 Jul 2026US 12,690,408 B2Kioxia Corporation
- Substrate processing module and substrate processing device provided with same14 Jul 2026US 12,678,833 B2Daikin Finetech, Ltd.
- Etching device and etching method thereof23 Jun 2026US 12,666,901 B2Zeus Co., Ltd.
- Apparatus and method of treating substrate3 Sep 2026US 2026/0262465 A1Semes Co., Ltd.
- Substrate processing apparatus including catalyst pad27 Aug 2026US 2026/0255909 A1Samsung Electronics Co., Ltd.
- Wafer processing apparatus and wafer processing system including the same13 Aug 2026US 2026/0239912 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus30 Jul 2026US 2026/0216757 A1ACM Research (Lingang), Inc.
- Substrate treatment device and substrate treatment method30 Jul 2026US 2026/0223624 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- Single wafer processor with a frame140US 5,222,310 ASemitool, Inc. · 1993
- Multi-station semiconductor processor with volatilization138US 5,377,708 ASemitool, Inc. · 1995
- Saving ion-damaged spacers114US 9,721,789 B1APPLIED Materials.Inc. · 2017
- Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization97US 5,235,995 ASemitool, Inc. · 1993
- Method for cleaning and drying a semiconductor wafer93US 5,571,337 AYieldUP International · 1996