Wafer processing apparatus and wafer processing system including the same

A semiconductor wafer processing system comprising:

• a bath configured to accommodate a liquid for processing a plurality of semiconductor wafers;
• a support connected to the bath and configured to support the plurality of semiconductor wafers in a configuration with wafers of the plurality of semiconductor wafers spaced apart from one another;
• a liquid supply nozzle configured to supply the liquid into the bath;
• a gas supply nozzle disposed below the plurality of semiconductor wafers and configured to supply a gas into the bath to generate bubbles with the liquid;
• a rod disposed above the gas supply nozzle and configured to change a path of bubbles that are generated by the gas and ascend within the bath along a first path that intercepts the rod;
• a driver configured to rotate the rod;
• and
• a control circuit configured to control the driver to rotate the rod to change the path of bubbles contacting the rod at a first time point from the first path to at least one of a second path and a third path and change the path of the bubbles contacting the rod at a second time point from the first path to at least one of a fourth path and a fifth path, wherein the second time point is different from the first time point and each of the fourth path and the fifth path is different from the second path and the third path.

A semiconductor wafer processing apparatus comprising:

• a bath configured to contain a liquid used to process a plurality of semiconductor wafers;
• a gas supply nozzle configured to supply a gas into the bath through a gas supply hole;
• a liquid supply nozzle configured to supply the liquid into the bath in a direction toward the gas supply hole, wherein the gas causes bubbles to form in the liquid;
• a rod disposed above the gas supply nozzle and configured to change a path of a portion of the bubbles that ascend within the bath;
• plates disposed within the bath at an upper portion of the bath;
• guides disposed on surfaces of the plates and configured to guide bubbles ascending in the bath to move outward from the bath;
• and
• a support connected to the bath and configured to support the plurality of semiconductor wafers in a configuration with semiconductor wafers of the plurality of semiconductor wafers spaced apart from each other with a side surface of each of the plurality of semiconductor wafers being disposed spaced apart from the plates by a predetermined gap, and an planar surface of each of the plurality of semiconductor wafers being parallel to the guides.