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US 12,666,901 B2Granted
Etching device and etching method thereof
AssigneeZeus Co., Ltd.
InventorsSeung Hoon Lee, Sung Won Mo, Yang Ho Lee, Jeong Hyun Bae, Seong Hwan Park, Hyun Dong Cho
Life of this patent
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Abstract
The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.
Claims8
An etching method comprising:
- a loading operation of opening an etching chamber to place an object;
- a pressurization operation of pressurizing an inside of the etching chamber;
- a heating operation of, when a temperature of an etchant is less than or equal to a set temperature, heating the etchant to the set temperature or a temperature higher than the set temperature;
- an etching operation of supplying the etchant into the etching chamber to etch the object;
- a rinsing operation of supplying a rinsing liquid into the etching chamber to remove by-products and the etchant remaining on the object;
- a cleaning operation of supplying a cleaning liquid into the etching chamber to remove the rinsing liquid remaining on the object;
- and
- an unloading operation of opening the etching chamber to discharge the object to the outside,
- wherein the pressurization operation includes operating a first pressurizer to pressurize the etching chamber and an etchant supply container to a set pressure, and operating a second pressurizer to maintain a pressurization storage container, which accommodates the rinsing liquid and the cleaning liquid discharged from the etching chamber, in a pressurized atmosphere.
6 more elements
Dependencies are inferred from the claim text.