H10P 72/0421
For drying etching
Official title: {for drying etching}
H10P72/0421 (For drying etching) appears on 3,023 US grants and 3,917 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,023
- Published applications
- 3,917
- Assignees
- 517
- Inventors
- 6,119
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 10 | 0 |
| 1990 | 13 | 0 |
| 1991 | 9 | 0 |
| 1992 | 10 | 0 |
| 1993 | 16 | 0 |
| 1994 | 19 | 0 |
| 1995 | 12 | 0 |
| 1996 | 9 | 0 |
| 1997 | 6 | 0 |
| 1998 | 17 | 0 |
| 1999 | 35 | 0 |
| 2000 | 43 | 0 |
| 2001 | 52 | 31 |
| 2002 | 54 | 66 |
| 2003 | 58 | 74 |
| 2004 | 62 | 139 |
| 2005 | 56 | 128 |
| 2006 | 51 | 114 |
| 2007 | 49 | 108 |
| 2008 | 46 | 141 |
| 2009 | 44 | 104 |
| 2010 | 64 | 95 |
| 2011 | 73 | 91 |
| 2012 | 78 | 72 |
| 2013 | 82 | 88 |
| 2014 | 98 | 147 |
| 2015 | 118 | 172 |
| 2016 | 124 | 147 |
| 2017 | 115 | 223 |
| 2018 | 152 | 243 |
| 2019 | 188 | 309 |
| 2020 | 243 | 300 |
| 2021 | 216 | 306 |
| 2022 | 204 | 214 |
| 2023 | 164 | 166 |
| 2024 | 155 | 157 |
| 2025 | 146 | 138 |
| 2026 | 99 | 144 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor processing preclean methods and apparatus6 Oct 2026US 12,757,665 B2ASM IP Holding B. V.
- Plasma processing device and plasma processing method6 Oct 2026US 12,757,669 B2Hitachi High-Tech Corporation
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Gas supply system, substrate processing apparatus and method of manufacturing semiconductor device29 Sep 2026US 12,751,235 B2Kokusai Electric Corporation
- Adapter plate to attach turbo pumps to process modules22 Sep 2026US 12,742,454 B2Lam Research Corporation
- Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus8 Oct 2026US 2026/0314297 A1Kokusai Electric Corporation
- Auxiliary ring in substrate processing apparatus8 Oct 2026US 2026/0314327 A1Samsung Electronics Co., Ltd.
- Etching method and etching apparatus1 Oct 2026US 2026/0305203 A1Hitachi High-Tech Corporation
- Systems and methods for etching a high aspect ratio structure1 Oct 2026US 2026/0305206 A1Lam Research Corporation
- Semiconductor processing tool and methods of operation1 Oct 2026US 2026/0305225 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Plasma processing apparatus634US 6,162,323 AJapan Science and Technology Corporation · 2000
- Methods and apparatus for atomic layer etching577US 8,617,411 B2Lam Research Corporation · 2013
- Shower head and plasma processing apparatus having same552US 8,282,769 B2Tokyo Electron Limited · 2012
- Semiconductor reaction chamber with plasma capabilities538US 9,018,111 B2ASM IP Holding B. V. · 2015
- Method of joining components for a composite showerhead electrode assembly for a plasma processing apparatus529US 8,484,846 B2Lam Research Corporation · 2013