Lid assembly for a processing system to facilitate sequential deposition techniques
AssigneeApplied Materials, Inc.
InventorsGwo-Chuan Tzu, Salvador P. Umotoy
Life of this patent
Estimating the term…
Abstract
A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having a gas manifold mounted on a first side and a baffle plate mounted on a second side. The gas manifold is configured to deliver a plurality of gases to a plenum defined between the baffle plate and the lid. The gases are mixed within a recess formed in the baffle plate before exiting into the processing system through a singular passage.
Claims23
A lid assembly for a semiconductor processing system, the lid assembly comprising:
- a lid having first and second opposed surfaces;
- a plurality of controllable flow channels extending from the first and second opposed surfaces;
- and
- a gas control system disposed on the first surface and operably opening and closing the channels, wherein the gas control system comprises:
- a gas manifold disposed on the lid;
- at least one valve coupled to the gas manifold and adapted to control a flow through one of the flow channels;
- and
- a reservoir positioned on the lid and fluidly connected to the gas manifold.
A lid assembly for a semiconductor processing system, the lid assembly comprising:
- a lid having first and second opposed surfaces, the first and second opposed surfaces having a first inlet channel, a second inlet channel and a third inlet channel disposed therethrough;
- a gas manifold coupled to the first surface of the lid, the gas manifold comprising:
- a body having an upper surface and lower surface;
- a first channel, a second channel, and a third channel each extending through the gas manifold to the lower surface;
- a valve coupled to the gas manifold;
- and
- a gas reservoir positioned on the lid and fluidly connected to the gas manifold.
A lid assembly for a semiconductor processing system, the lid assembly comprising:
- a lid having first and second opposed surfaces, the first and second opposed surfaces having a plurality of inlet channels disposed therethrough;
- a valve;
- a gas manifold coupled to the first surface of the lid, the gas manifold comprising:
- a body having an upper surface and lower surface;
- a plurality of gas channels extending through the gas manifold to the lower surface;
- and
- a thermal conditioning channel disposed in the gas manifold and fluidly coupled to at least one of the plurality of gas channels by the valve;
- and
- a gas reservoir fluidly positioned on the lid, connected to the gas manifold, and fluidly coupled to the valve by the thermal conditioning channel.
A lid assembly for a semiconductor processing system, comprising:
- a lid having a first surface opposed to a second surface;
- at least one controllable flow channel extending from the first surface through the second surface;
- and
- a gas control system disposed on the first surface and operably opening and closing the at least one controllable flow channel, wherein the gas control system comprises:
- a gas manifold disposed on the lid;
- at least one valve coupled to the gas manifold adapted to control a flow through the at least one controllable flow channel;
- and
- at least one precursor reservoir fluidly connected between at least one precursor source and the gas manifold.
A lid assembly for a semiconductor processing system, comprising:
- a lid having a first surface opposed to a second surface;
- and
- a gas control system disposed on the first surface and operably opening and closing at least one controllable flow channel, wherein the gas control system comprises:
- a gas manifold disposed on the lid;
- at least one valve coupled to the gas manifold and adapted to control a flow through the at least one controllable flow channel;
- at least one precursor reservoir fluidly connected to the gas manifold;
- and
- at least one precursor source fluidly connected to the at least one precursor reservoir.
Dependencies are inferred from the claim text.