H10P 72/0406
For cleaning followed by drying, rinsing, stripping, blasting or the like
Official title: {for cleaning followed by drying, rinsing, stripping, blasting or the like}
H10P72/0406 (For cleaning followed by drying, rinsing, stripping, blasting or the like) appears on 6,151 US grants and 7,299 published applications in this corpus.
Search patents in H10P- Granted patents
- 6,151
- Published applications
- 7,299
- Assignees
- 1,071
- Inventors
- 10,245
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 10 | 0 |
| 1986 | 4 | 0 |
| 1987 | 12 | 0 |
| 1988 | 20 | 0 |
| 1989 | 14 | 0 |
| 1990 | 24 | 0 |
| 1991 | 27 | 0 |
| 1992 | 35 | 0 |
| 1993 | 33 | 0 |
| 1994 | 53 | 0 |
| 1995 | 38 | 0 |
| 1996 | 47 | 0 |
| 1997 | 58 | 0 |
| 1998 | 101 | 0 |
| 1999 | 175 | 0 |
| 2000 | 191 | 0 |
| 2001 | 208 | 114 |
| 2002 | 231 | 256 |
| 2003 | 249 | 247 |
| 2004 | 184 | 292 |
| 2005 | 165 | 243 |
| 2006 | 133 | 274 |
| 2007 | 119 | 287 |
| 2008 | 97 | 258 |
| 2009 | 96 | 244 |
| 2010 | 118 | 186 |
| 2011 | 165 | 190 |
| 2012 | 158 | 246 |
| 2013 | 152 | 246 |
| 2014 | 167 | 261 |
| 2015 | 166 | 270 |
| 2016 | 173 | 229 |
| 2017 | 235 | 279 |
| 2018 | 209 | 348 |
| 2019 | 227 | 324 |
| 2020 | 314 | 359 |
| 2021 | 270 | 341 |
| 2022 | 235 | 389 |
| 2023 | 300 | 409 |
| 2024 | 337 | 397 |
| 2025 | 337 | 350 |
| 2026 | 252 | 260 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate processing system6 Oct 2026US 12,752,315 B2SCREEN Holdings Co., Ltd.
- Baffle inspection apparatus6 Oct 2026US 12,754,090 B2Samsung Electronics Co., Ltd.
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Mitigation of capillary pattern collapse in supercritical dry6 Oct 2026US 12,757,666 B2Tokyo Electron Limited
- Wet cleaning tool and method6 Oct 2026US 12,757,668 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bowl assembly and substrate processing apparatus comprising the same8 Oct 2026US 2026/0307119 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0307120 A1Tokyo Electron Limited
- Semiconductor process system and method of cleaning the same8 Oct 2026US 2026/0308756 A1Samsung Electronics Co., Ltd.
- Dehumidifying module, wafer processing apparatus8 Oct 2026US 2026/0309414 A1Ebara Corporation
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314295 A1Ebara Corporation
Most cited
By later US patents
- Plasma cleaning method for removing residues in a plasma treatment chamber842US 5,356,478 ALam Research Corporation · 1994
- Method for improved remote microwave plasma source for use with substrate processing system621US 6,271,148 B1APPLIED Materials.Inc. · 2001
- Electronic substrate processing system using portable closed containers and its equipments568US 5,621,982 AShinko Electric Co., Ltd. · 1997
- Drying processing method and apparatus using same547US 6,134,807 AMotoyama Eng. Works, Ltd. · 2000
- Semiconductor device manufacturing system534US 6,212,789 B1Canon Sales Co., Inc. · 2001