H10P 72/0408
For drying
Official title: {for drying}
H10P72/0408 (For drying) appears on 939 US grants and 1,190 published applications in this corpus.
Search patents in H10P- Granted patents
- 939
- Published applications
- 1,190
- Assignees
- 268
- Inventors
- 2,013
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 9 | 0 |
| 1999 | 15 | 0 |
| 2000 | 33 | 0 |
| 2001 | 17 | 17 |
| 2002 | 34 | 35 |
| 2003 | 39 | 36 |
| 2004 | 31 | 57 |
| 2005 | 28 | 39 |
| 2006 | 29 | 54 |
| 2007 | 18 | 42 |
| 2008 | 18 | 37 |
| 2009 | 23 | 29 |
| 2010 | 16 | 32 |
| 2011 | 20 | 22 |
| 2012 | 30 | 34 |
| 2013 | 14 | 34 |
| 2014 | 27 | 30 |
| 2015 | 12 | 29 |
| 2016 | 26 | 18 |
| 2017 | 25 | 33 |
| 2018 | 23 | 55 |
| 2019 | 33 | 62 |
| 2020 | 49 | 62 |
| 2021 | 48 | 47 |
| 2022 | 43 | 76 |
| 2023 | 36 | 72 |
| 2024 | 60 | 82 |
| 2025 | 65 | 96 |
| 2026 | 58 | 60 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Mitigation of capillary pattern collapse in supercritical dry6 Oct 2026US 12,757,666 B2Tokyo Electron Limited
- Spraying nozzle type of an apparatus for removing a residual gas on a wafer29 Sep 2026US 12,751,234 B2VM Inc.
- Wafer cleaning method and system using heated functional plate22 Sep 2026US 12,745,585 B2Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus22 Sep 2026US 12,745,586 B2Ebara Corporation
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0307120 A1Tokyo Electron Limited
- Operation method and device for cleaning foup8 Oct 2026US 2026/0314317 A1Asia Neo Tech Industrial Co., Ltd.
- Substrate processing apparatus and substrate processing method1 Oct 2026US 2026/0305239 A1SCREEN Holdings Co., Ltd.
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293570 A1SCREEN Holdings Co., Ltd.
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293572 A1Shibaura Mechatronics Corporation
Most cited
By later US patents
- Drying processing method and apparatus using same547US 6,134,807 AMotoyama Eng. Works, Ltd. · 2000
- Substrate processing method, and method of manufacturing semiconductor device531US 8,393,091 B2Fujitsu Semiconductor Limited · 2013
- Substrate processing method, substrate processing apparatus, and program storage medium523US 8,020,315 B2Tokyo Electron Limited · 2011
- Apparatus for manufacturing semiconductor wafer510US 6,578,589 B1Super Silicon Crystal Research Institute Corp. · 2003
- Method and apparatus for drying substrates506US 5,884,640 AAPPLIED Materials.Inc. · 1999