Substrate processing apparatus and substrate processing method
AssigneeSCREEN Holdings Co., Ltd.
InventorsTakashi IZUTA, Ryunosuke UETA
Life of this patent
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Abstract
A yield of a product is improved. The substrate processing apparatus includes a control section, and in cooperation with a memory, the control section carries out control to (i) immerse a substrate in a processing liquid stored in a processing tank, (ii) make an atmosphere of an organic solvent gas in a chamber, (iii) supply the organic solvent gas toward an area including a contact position between a lifter and the substrate in a state in which the substrate is pulled out of the processing tank, and (iv) supply the organic solvent gas toward the area including the contact position between the lifter and the substrate with the chamber in a depressurized state and continue the supply for a predetermined time period.
Claims4
A substrate processing apparatus configured to carry out a predetermined process on a substrate, the substrate processing apparatus comprising:
- a processing tank storing a processing liquid;
- a chamber accommodating the processing tank;
- a lifter retaining the substrate;
- a movement mechanism configured to raise and lower the lifter between a first position where the substrate is immersed in the processing liquid inside the processing tank and a second position where the substrate is located outside the processing tank;
- a processing liquid nozzle configured to supply a processing liquid to the processing tank;
- a gas nozzle configured to supply an inert gas or organic solvent gas into the chamber;
- a control section configured to control an operation by the movement mechanism and control a supply operation for a processing liquid by the processing liquid nozzle, a supply operation for the inert gas by the gas nozzle, and a supply operation for the organic solvent gas by the gas nozzle;
- and
- a memory storing information indicating a control operation of the control section, wherein
- in cooperation with the memory, the control section carries out control to
- (i) immerse the substrate in the processing liquid stored in the processing tank,
- (ii) make an atmosphere of the organic solvent gas in the chamber,
- (iii) supply the organic solvent gas toward an area including a contact position between the lifter and the substrate in a state in which the substrate is pulled out of the processing tank, and
- (iv) supply the organic solvent gas toward the area including the contact position between the lifter and the substrate with the chamber in a depressurized state and continue the supply for a predetermined time period.
A substrate processing method for a substrate processing apparatus configured to carry out a predetermined process on a substrate,
- the substrate processing apparatus including
- a processing tank storing a processing liquid,
- a chamber accommodating the processing tank,
- a lifter retaining the substrate,
- a movement mechanism configured to raise and lower the lifter between a first position where the substrate is immersed in the processing liquid inside the processing tank and a second position where the substrate is located outside the processing tank,
- a processing liquid nozzle configured to supply a processing liquid to the processing tank, and
- a gas nozzle configured to supply an inert gas or organic solvent gas into the chamber,
- the substrate processing method comprising:
- (i) immersing the substrate in the processing liquid stored in the processing tank;
- (ii) making an atmosphere of the organic solvent gas in the chamber;
- (iii) supplying the organic solvent gas toward an area including a contact position between the lifter and the substrate in a state in which the substrate is pulled out of the processing tank;
- and
- (iv) supplying the organic solvent gas toward the area including the contact position between the lifter and the substrate with the chamber in a depressurized state and continuing the supplying for a predetermined time period.
Dependencies are inferred from the claim text.