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US 12,751,234 B2Granted
Spraying nozzle type of an apparatus for removing a residual gas on a wafer
AssigneeVM Inc.
InventorsHwi Gon Jang, Woo Hyung Choi, Byeong Jun Jung, Jin Myeong Lee
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Abstract
An apparatus for removing a residual gas on a wafer comprises at least one spraying nozzle disposed at a front of a loading volume formed within a housing and extending linearly along a horizontal direction respectively; and a plurality of spraying holes formed at each spraying nozzle along the extending direction of each spraying nozzle, wherein the residual gas or a contaminating matter on a surface of the wafer is removed by a gas or a CDA (Clean Dry Air) sprayed through the plurality of the spraying holes.
Claims6
An apparatus for removing a residual gas on a wafer, comprising:
- a plurality of spraying nozzles disposed at a front of a loading volume formed within a housing, and each spraying nozzle extending linearly along a horizontal direction and having a linear rod shape;
- and
- a plurality of spraying holes formed at the each spraying nozzle along the extending direction thereof,
- wherein the residual gas or a contaminating matter on a surface of the wafer is removed by a gas or a CDA (Clean Dry Air) sprayed through the plurality of spraying holes,
- wherein the plurality of spraying nozzles are arranged along a vertical direction so that a lower part of the each spraying nozzle is located at a position corresponding to a predetermined height from an upper surface of the wafer moving to the loading volume, and
- wherein the plurality of spraying holes are formed in a spiral shape along the extending direction of the each spraying nozzle.
3 more elements
Dependencies are inferred from the claim text.