Substrate processing apparatus and substrate processing method
AssigneeShibaura Mechatronics Corporation
InventorsRie TESHIMA, Jun MATSUSHITA, Hikaru HOSHINO, Kengo KAMEI
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AssigneeShibaura Mechatronics Corporation
InventorsRie TESHIMA, Jun MATSUSHITA, Hikaru HOSHINO, Kengo KAMEI
Estimating the term…
According to one embodiment of the present disclosure, a substrate processing apparatus includes: a processing liquid supply unit that supplies a processing liquid to a substrate; a heating unit that irradiates light onto the substrate, thereby heating the substrate; a cover body including an opposing surface that faces the substrate held by a rotary holding unit, and transmitting the light irradiated by the heating unit; and a control device that controls the processing liquid supply unit and the heating unit. The control device is configured to supply the processing liquid to the rotating substrate, thereby processing the substrate, and perform a first drying process that irradiates the light onto the substrate held by the rotary holding unit to heat the substrate, thereby drying the opposing surface of the cover body.
A substrate processing apparatus comprising:
A substrate processing method, comprising:
Dependencies are inferred from the claim text.