Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method for cleaning a substrate after polishing. The substrate cleaning apparatus includes a cleaning apparatus (131) for cleaning a polished substrate. The cleaning apparatus (131) includes a microbubble-water module (90) for injecting microbubble water onto the surface of the substrate (W), held in a substrate cleaning holder (52), to clean a surface of the substrate (W). The microbubble-water module (90) includes an injection nozzle (91) for injecting the microbubble water onto a target region (TR), which is an elongated region extending from a center (Cr) to an outer peripheral portion (Ci) of the substrate (W), and a microbubble-water supply device (93) for supplying the microbubble water to the injection nozzle (91).

Dependencies are inferred from the claim text.