H10P 72/0404
For general liquid treatment
Official title: {for general liquid treatment, e.g. etching followed by cleaning}
H10P72/0404 (For general liquid treatment) appears on 545 US grants and 619 published applications in this corpus.
Search patents in H10P- Granted patents
- 545
- Published applications
- 619
- Assignees
- 178
- Inventors
- 1,367
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 6 | 0 |
| 1991 | 9 | 0 |
| 1992 | 9 | 0 |
| 1993 | 19 | 0 |
| 1994 | 10 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 15 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 7 | 3 |
| 2002 | 4 | 7 |
| 2003 | 3 | 7 |
| 2004 | 3 | 3 |
| 2005 | 6 | 16 |
| 2006 | 5 | 5 |
| 2007 | 2 | 6 |
| 2008 | 6 | 14 |
| 2009 | 3 | 5 |
| 2010 | 5 | 4 |
| 2011 | 7 | 8 |
| 2012 | 8 | 6 |
| 2013 | 7 | 14 |
| 2014 | 9 | 18 |
| 2015 | 11 | 23 |
| 2016 | 7 | 17 |
| 2017 | 18 | 39 |
| 2018 | 27 | 51 |
| 2019 | 33 | 33 |
| 2020 | 37 | 47 |
| 2021 | 35 | 45 |
| 2022 | 32 | 56 |
| 2023 | 35 | 48 |
| 2024 | 43 | 58 |
| 2025 | 46 | 46 |
| 2026 | 35 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Substrate treating apparatus and substrate treating method6 Oct 2026US 12,757,672 B2Semes Co., Ltd.
- Substrate processing apparatus and substrate processing method6 Oct 2026US 12,757,674 B2Tokyo Electron Limited
- In situ film growth sensor assembly, apparatus, and methods22 Sep 2026US 12,745,604 B2APPLIED Materials.Inc.
- Point of use or point of dispense filter with multiple pleat packs15 Sep 2026US 12,734,488 B2Entegris, Inc.
- Diaphragm pump8 Oct 2026US 2026/0309142 A1Ckd Corporation
- Spraying member and method of processing substrate using the spraying member1 Oct 2026US 2026/0305222 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Cooling apparatus, substrate processing apparatus and a method for cooling a processing liquid1 Oct 2026US 2026/0305223 A1SCREEN Holdings Co., Ltd.
- Bonding apparatus, bonding system, and bonding method1 Oct 2026US 2026/0305226 A1Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0284694 A1Semes Co., Ltd.
Most cited
By later US patents
- Temperature control system for semiconductor process chamber652US 6,015,465 AAPPLIED Materials.Inc. · 2000
- Method and apparatus for improving planarity of chemical-mechanical planarization operations307US 5,232,875 AMicron Technology, Inc. · 1993
- Process and apparatus for treating wafers with process fluids185US 4,778,532 ACFM Technologies Limited Partnership · 1988
- Apparatus for wafer processing with in situ rinse153US 5,169,408 AFSI International, Inc. · 1992
- Method of manufacturing semiconductor device139US 5,593,926 ASumitomo Electric Industries, Ltd. · 1997