Spraying member and method of processing substrate using the spraying member
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYOU-JHANG WU, MING-CHE LI, CHENG-KUANG CHEN, CHIH-WEI WEN
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYOU-JHANG WU, MING-CHE LI, CHENG-KUANG CHEN, CHIH-WEI WEN
Estimating the term…
The present disclosure provides a method of processing a substrate. The method includes: placing a spraying member proximal to the substrate, wherein the spraying member includes a first segment and a second segment coupled to the first segment, the first segment is adjustable relative to the second segment, and the first segment has a first opening configured to discharge a fluid out of the spraying member; adjusting the first segment relative to the second segment; and discharging the fluid from the first opening. The adjustment of the first segment includes extending the first segment from the second segment, retracting the first segment toward the second segment, or rotating the first segment relative to the second segment. The first opening is movable relative to and along a slot of the first segment. A size of the first opening is also adjustable.
A method of processing a substrate, comprising:
A method of processing a substrate, comprising:
A spraying member, comprising:
Dependencies are inferred from the claim text.