Substrate processing method and substrate processing apparatus

A substrate processing method for processing a substrate using a substrate processing apparatus, the substrate processing apparatus including:

• a spin chuck that holds and rotates a substrate in a horizontal orientation;
• a brush that is movable from a center of the substrate toward a perimeter of the substrate and performs brush cleaning by exerting force onto an upper surface of the substrate;
• a rinsing liquid nozzle that is provided at a fixed position offset from the center of the substrate and discharges a rinsing liquid onto the upper surface of the substrate;
• and
• a chemical liquid nozzle that is movable from a retracted position offset from the center of the substrate toward the center of the substrate, and that discharges a chemical liquid downwards onto the upper surface of the substrate from above the center of the substrate, the substrate processing method comprising:
• (a) moving the brush exerting force on the upper surface of the substrate being rotated by the spin chuck from the center of the substrate toward the perimeter of the substrate, while causing the rinsing liquid nozzle to discharge the rinsing liquid onto the upper surface;
• (b) stopping discharge of the rinsing liquid from the rinsing liquid nozzle when the brush having moved toward the perimeter of the substrate arrives at a switching position set in advance between the center of the substrate and the perimeter of the substrate;
• and
• (c) moving, after (b) stopping discharge of the rinsing liquid from the rinsing liquid nozzle, the brush exerting force on the upper surface of the substrate from the switching position toward the perimeter of the substrate while causing the chemical liquid nozzle to discharge the chemical liquid onto the upper surface of the substrate being rotated.