H10P 50/693
Characterised by their size, orientation, disposition, behaviour or shape, in horizontal or
Official title: {characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane}
H10P50/693 (Characterised by their size, orientation, disposition, behaviour or shape, in horizontal or) appears on 4,098 US grants and 4,386 published applications in this corpus.
Search patents in H10P- Granted patents
- 4,098
- Published applications
- 4,386
- Assignees
- 647
- Inventors
- 6,769
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 6 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 9 | 0 |
| 1986 | 6 | 0 |
| 1987 | 16 | 0 |
| 1988 | 11 | 0 |
| 1989 | 8 | 0 |
| 1990 | 11 | 0 |
| 1991 | 17 | 0 |
| 1992 | 16 | 0 |
| 1993 | 13 | 0 |
| 1994 | 16 | 0 |
| 1995 | 17 | 0 |
| 1996 | 7 | 0 |
| 1997 | 19 | 0 |
| 1998 | 13 | 0 |
| 1999 | 23 | 0 |
| 2000 | 19 | 0 |
| 2001 | 28 | 9 |
| 2002 | 34 | 33 |
| 2003 | 24 | 33 |
| 2004 | 30 | 61 |
| 2005 | 43 | 58 |
| 2006 | 44 | 68 |
| 2007 | 35 | 78 |
| 2008 | 37 | 89 |
| 2009 | 35 | 72 |
| 2010 | 77 | 99 |
| 2011 | 81 | 83 |
| 2012 | 78 | 111 |
| 2013 | 100 | 134 |
| 2014 | 145 | 232 |
| 2015 | 261 | 379 |
| 2016 | 386 | 411 |
| 2017 | 368 | 368 |
| 2018 | 333 | 292 |
| 2019 | 342 | 333 |
| 2020 | 338 | 326 |
| 2021 | 246 | 239 |
| 2022 | 169 | 214 |
| 2023 | 171 | 229 |
| 2024 | 191 | 186 |
| 2025 | 177 | 161 |
| 2026 | 85 | 88 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Assembly structure including a plurality of spacers and method of manufacturing the same6 Oct 2026US 12,757,375 B2Nanya Technology Corporation
- Enhancement-mode HEMT and manufacturing process of the same6 Oct 2026US 12,757,427 B2STMicroelectronics S,r.l.
- Semiconductor device, semiconductor structure and method for fabricating semiconductor device and semiconductor structure using tilted etch process6 Oct 2026US 12,757,661 B2Nanya Technology Corporation
- Protection of STI features22 Sep 2026US 12,745,614 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of fine pitch pattering for semiconductor device and method of manufacturing the same15 Sep 2026US 12,740,358 B2Samsung Electronics Co., Ltd.
- Semiconductor structure and method for forming the same8 Oct 2026US 2026/0314008 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Gate structure and method1 Oct 2026US 2026/0304884 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device manufacturing method and semiconductor device24 Sep 2026US 2026/0293558 A1Rapidus Corporation
- Frame mask for singulating wafers by plasma etching24 Sep 2026US 2026/0293563 A1UTAC Headquarters Pte. Ltd.
Most cited
By later US patents
- Cut-mask patterning process for fin-like field effect transistor (FinFET) device3,286US 9,236,267 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Method for reducing, by a factor or 2.sup.-N, the minimum masking pitch of a photolithographic process1,059US 5,328,810 AMicron Technology, Inc. · 1994
- Method for integrated circuit patterning805US 9,184,054 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2015