H10P 14/6926
The material comprising alkyl silsesquioxane
Official title: {the material comprising alkyl silsesquioxane, e.g. MSQ}
H10P14/6926 (The material comprising alkyl silsesquioxane) appears on 141 US grants and 135 published applications in this corpus.
Search patents in H10P- Granted patents
- 141
- Published applications
- 135
- Assignees
- 70
- Inventors
- 386
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 7 | 2 |
| 2002 | 8 | 13 |
| 2003 | 3 | 12 |
| 2004 | 14 | 14 |
| 2005 | 8 | 22 |
| 2006 | 8 | 11 |
| 2007 | 8 | 6 |
| 2008 | 3 | 7 |
| 2009 | 8 | 8 |
| 2010 | 9 | 4 |
| 2011 | 6 | 3 |
| 2012 | 2 | 2 |
| 2013 | 7 | 5 |
| 2014 | 2 | 3 |
| 2015 | 6 | 1 |
| 2016 | 2 | 1 |
| 2017 | 2 | 4 |
| 2018 | 3 | 3 |
| 2019 | 2 | 2 |
| 2020 | 2 | 2 |
| 2021 | 1 | 3 |
| 2022 | 4 | 2 |
| 2023 | 2 | 2 |
| 2024 | 0 | 0 |
| 2025 | 1 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium13 Jan 2026US 12,525,450 B2Kokusai Electric Corporation
- System for dispensing spin-on glass (SOG) and method of using8 Apr 2025US 12,272,549 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Passivation against vapor deposition29 Aug 2023US 11,739,422 B2ASM IP Holding B. V.
- Photosensitive siloxane composition and cured film formed by using the same9 May 2023US 11,644,754 B2Merck Patent GmbH
- System and method for dispensing liquid spin-on glass (SOG) onto semiconductor wafers13 Sep 2022US 11,443,939 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus, recording medium, method of processing substrate, and method of manufacturing semiconductor device2 Apr 2026US 2026/0096360 A1Kokusai Electric Corporation
- Curable resin composition, cured film, laminate, imaging device, semiconductor device, method for manufacturing laminate, and method for manufacturing element having contact electrode13 Feb 2025US 2025/0051573 A1Sekisui Chemical Co., Ltd.
- Curable resin composition, cured film, multilayered object, imaging device, semiconductor device, method for producing multilayered object, and method for producing element having junction electrode13 Feb 2025US 2025/0054895 A1Sekisui Chemical Co., Ltd.
- Laminate, curable resin composition, method for manufacturing laminate, method for manufacturing substrate having junction electrode, semiconductor device, and image capturing device3 Aug 2023US 2023/0245936 A1Sekisui Chemical Co., Ltd.
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium15 Jun 2023US 2023/0183864 A1Kokusai Electric Corporation
Most cited
By later US patents
- Plasma curing of MSQ-based porous low-k film materials567US 6,759,098 B2Axcelis Technologies, Inc. · 2004
- Dual in-laid integrated circuit structure with selectively positioned low-K dielectric isolation and method of formation162US 6,143,646 AMotorola, Inc. · 2000
- Electronic device having multilayer wiring structure85US 4,349,609 AFujitsu Limited · 1982
- Integration of low-k polymers into interlevel dielectrics using controlled electron-beam radiation83US 6,080,526 AAlliedSignal Inc. · 2000
- Photoresist stripping without degrading low dielectric constant materials81US 6,030,901 AAdvanced Micro Devices, Inc. · 2000