Electronic device having multilayer wiring structure
AssigneeFujitsu Limited
InventorsShiro Takeda, Minoru Nakajima
Life of this patent
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Abstract
An improved electronic device having a multilayer wiring structure. An interlayer insulation layer or at least one of plural interlayer insulation layers, formed between metal wiring layers, is comprised of a cured coating of a ladder-type silsesquioxane polymer. A layer for protecting a metal wiring layer or layers may also be comprised of a cured coating of a similar polymer. The specified cured coating exhibits good resistance to heat and moisture and enhanced levelling on a pattern.
Claims20
An electronic device having a multilayer wiring structure comprising:
- a substrate having formed thereon a first metal wiring layer, and;
- an interlayer insulation layer comprised of a cured coating of a ladder-type silsesquioxane polymer, formed on the substrate and on said first metal wiring layer and having formed thereon a second metal wiring layer.
An electronic device having a structure of multiple wiring layers comprising:
- a layer for protecting each metal wiring layer formed in the multiple layer wiring structure;
- said protecting layer being comprised of a cured coating of a ladder-type silsesquioxane polymer.
Dependencies are inferred from the claim text.