H10D 84/981
Power supply lines
Official title: {Power supply lines}
H10D84/981 (Power supply lines) appears on 297 US grants and 463 published applications in this corpus.
Search patents in H10D- Granted patents
- 297
- Published applications
- 463
- Assignees
- 57
- Inventors
- 616
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 8 |
| 2013 | 5 | 6 |
| 2014 | 5 | 6 |
| 2015 | 7 | 6 |
| 2016 | 6 | 10 |
| 2017 | 12 | 18 |
| 2018 | 16 | 25 |
| 2019 | 22 | 34 |
| 2020 | 31 | 31 |
| 2021 | 26 | 44 |
| 2022 | 19 | 47 |
| 2023 | 34 | 59 |
| 2024 | 46 | 72 |
| 2025 | 43 | 60 |
| 2026 | 22 | 34 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Hybrid cell height design with a backside power distribution network29 Sep 2026US 12,751,083 B2International Business Machines Corporation
- Method and IC design with non-linear power rails29 Sep 2026US 12,751,260 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Backside programmable gate array1 Sep 2026US 12,727,242 B2International Business Machines Corporation
- Compatible hybrid-cell structure, device having the same, and method25 Aug 2026US 12,720,861 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure with front side signal lines and backside power delivery4 Aug 2026US 12,701,782 B2Intel Corporation
- Integrated circuit device1 Oct 2026US 2026/0304952 A1Samsung Electronics Co., Ltd.
- Semiconductor structure1 Oct 2026US 2026/0304954 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Device Disaggregation For Improved Performance27 Aug 2026US 2026/0255673 A1Adeia Semiconductor Inc.
- Semiconductor device and method of fabricating the same13 Aug 2026US 2026/0239735 A1Samsung Electronics Co., Ltd.
- Device having pairs of stacked power rail structures surrounding double-row complementary field-effect transistors13 Aug 2026US 2026/0239952 A1Imec Vzw
Most cited
By later US patents
- Three-dimensional device and method of forming the same26US 10,770,479 B2Tokyo Electron Limited · 2020
- Semiconductor device including back side power supply circuit26US 10,950,546 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2021
- Semiconductor device24US 9,887,210 B2Samsung Electronics Co., Ltd. · 2018
- Integrated circuit layouts with power rails under bottom metal layer23US 8,507,957 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Multiple split rail standard cell library architecture21US 9,502,351 B1QUALCOMM Incorporated · 2016