Device Disaggregation For Improved Performance

A method of manufacturing a microelectronic device, the method comprising:

• providing a plurality of dies, each die of the plurality of dies comprising one or more circuit elements, wherein each die of the plurality of dies is fabricated in a first process node;
• providing a substrate comprising one or more routing layers, wherein at least a portion of the substrate is fabricated in a second process node, the first process node being a more advanced node than the second process node;
• and
• direct hybrid bonding the plurality of dies to the substrate, wherein at least some of the one or more routing layers communicatively couple a circuit element of one die of the plurality of dies to another circuit element of another die of the plurality of dies through interconnections formed by the direct hybrid bonding.

A method of manufacturing a microelectronic device, the method comprising:

• providing a plurality of dies comprising active circuitry fabricated in a first process node;
• providing a substrate comprising a semiconductor material and one or more routing layers, wherein at least a portion of the substrate is fabricated in a second process node, the first process node being a more advanced node than the second process node;
• and
• direct hybrid bonding the plurality of dies to the substrate, wherein at least some of the one or more routing layers communicatively couple the plurality of dies through interconnections formed by the direct hybrid bonding.

A method of manufacturing a microelectronic device, the method comprising:

• providing dies comprising active circuitry, the active circuitry comprising a plurality of circuit elements in the at least a first die of the dies, wherein the dies are fabricated in a first process node;
• providing a substrate comprising a semiconductor material and one or more routing layers, wherein at least a portion of the substrate is fabricated in a second process node, the first process node being a more advanced node than the second process node;
• and
• direct hybrid bonding the substrate to the dies, wherein at least some of the one or more routing layers communicatively couple the first die to at least another die of the dies through interconnections formed by the direct hybrid bonding between the substrate and the dies.