Backside programmable gate array
AssigneeInternational Business Machines Corporation
InventorsAlbert M. Chu, Brent A. Anderson, Junli Wang, Albert M. Young, Ruilong Xie, Carl Radens
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AssigneeInternational Business Machines Corporation
InventorsAlbert M. Chu, Brent A. Anderson, Junli Wang, Albert M. Young, Ruilong Xie, Carl Radens
Estimating the term…
Embodiments of the present invention are directed to processing methods and resulting structures for integrated circuits having backside programmable gate arrays. In a non-limiting embodiment, a front end of line structure having an array of transistors is formed such that each transistor of the array of transistors includes one or more placeholder backside vias. A first portion of the backside vias defines one or more placeholder backside vias and a second portion of the one or more backside vias defines one or more programmed backside vias. A back end of line structure is formed on a first surface of the front end of line structure. A backside structure is formed on a second surface of the front end of line structure opposite the first surface. The backside structure includes a backside metallization layer in direct contact with the one or more programmed backside vias.
A method for forming a semiconductor device, the method comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.