H10D 1/042
Using deposition processes to form electrode extensions
Official title: {using deposition processes to form electrode extensions}
H10D1/042 (Using deposition processes to form electrode extensions) appears on 2,697 US grants and 2,823 published applications in this corpus.
Search patents in H10D- Granted patents
- 2,697
- Published applications
- 2,823
- Assignees
- 343
- Inventors
- 3,907
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 17 | 0 |
| 1993 | 11 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 20 | 0 |
| 1997 | 20 | 0 |
| 1998 | 38 | 0 |
| 1999 | 57 | 0 |
| 2000 | 131 | 0 |
| 2001 | 151 | 67 |
| 2002 | 149 | 156 |
| 2003 | 137 | 140 |
| 2004 | 130 | 150 |
| 2005 | 93 | 141 |
| 2006 | 126 | 197 |
| 2007 | 103 | 135 |
| 2008 | 98 | 115 |
| 2009 | 82 | 89 |
| 2010 | 116 | 108 |
| 2011 | 73 | 80 |
| 2012 | 68 | 85 |
| 2013 | 80 | 96 |
| 2014 | 87 | 64 |
| 2015 | 92 | 68 |
| 2016 | 61 | 58 |
| 2017 | 52 | 43 |
| 2018 | 48 | 59 |
| 2019 | 58 | 69 |
| 2020 | 71 | 81 |
| 2021 | 58 | 85 |
| 2022 | 57 | 107 |
| 2023 | 81 | 181 |
| 2024 | 116 | 141 |
| 2025 | 114 | 154 |
| 2026 | 77 | 154 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Capacitor structure for an integrated circuit396US 5,583,359 ANorthern Telecom Limited · 1996
- Method for fabricating a cylinder-type capacitor utilizing a connected ring structure330US 7,910,452 B2Hynix Semiconductor Inc. · 2011
- Reduced mask CMOS process for fabricating stacked capacitor multi-megabit dynamic random access memories utilizing single etch stop layer for contacts248US 5,292,677 AMicron Technology, Inc. · 1994
- Films doped with carbon for use in integrated circuit technology244US 6,462,371 B1Micron Technology, Inc. · 2002
- Method of forming a stacked capacitor with striated electrode231US 5,238,862 AMicron Technology, Inc. · 1993