Logic device and manufacturing method thereof

A logic device, comprising:

• a substrate;
• at least one first insulating layer on the substrate, the at least one first insulating layer including a plurality of through-holes;
• a second insulating layer on the at least one first insulating layer;
• wires in the at least one first insulating layer and the second insulating layer;
• and
• a capacitor portion in the at least one first insulating layer and the second insulating layer, the capacitor portion including:
• a lower plate layer, a first portion of the wires being electrically connected to the lower plate layer,
• a capacitor structure on the lower plate layer, the capacitor structure continuously extending along an upper surface of the lower plate layer, an inner surface of the plurality of through-holes, and an upper surface of the at least one first insulating layer around each of the plurality of through-holes,
• an interconnect member on the capacitor structure, and
• an upper plate layer on the interconnect member, a second portion of the wires being electrically connected to the upper plate layer,
• wherein a ratio of a width of each of the plurality of through-holes to a width of each of the wires is 1:5 to 1:10.

A manufacturing method of a logic device, the method comprising:

• forming a lower plate layer and a first insulating layer on a substrate, such that the lower plate layer is between the substrate and the first insulating layer;
• forming a plurality of wires in the first insulating layer;
• forming a plurality of through-holes in the first insulating layer to expose the lower plate layer;
• forming a capacitor structure in the plurality of through-holes of the first insulating layer, such that the capacitor structure continuously extends along an upper surface of the lower plate layer exposed by the plurality of through-holes, along inner surfaces of the plurality of through-holes, and an upper surface of the first insulating layer;
• forming a plurality of filling plugs filling the capacitor structure in the plurality of through-holes, and depositing a plate member connecting the plurality of filling plugs on the plurality of filling plugs;
• depositing an upper plate layer on the plate member;
• etching the capacitor structure, the plate member, and the upper plate layer in an area in which the plurality of wires are formed;
• and
• forming a first wire connected to the upper plate layer and a second wire connected to the lower plate layer.