H10D 1/01
Manufacture or treatment
Official title: {Manufacture or treatment}
H10D1/01 (Manufacture or treatment) appears on 4,488 US grants and 4,533 published applications in this corpus.
Search patents in H10D- Granted patents
- 4,488
- Published applications
- 4,533
- Assignees
- 574
- Inventors
- 6,494
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 20 | 0 |
| 1990 | 10 | 0 |
| 1991 | 20 | 0 |
| 1992 | 32 | 0 |
| 1993 | 40 | 0 |
| 1994 | 23 | 0 |
| 1995 | 29 | 0 |
| 1996 | 44 | 0 |
| 1997 | 36 | 0 |
| 1998 | 68 | 0 |
| 1999 | 97 | 0 |
| 2000 | 189 | 0 |
| 2001 | 212 | 85 |
| 2002 | 204 | 198 |
| 2003 | 194 | 201 |
| 2004 | 198 | 227 |
| 2005 | 145 | 228 |
| 2006 | 190 | 261 |
| 2007 | 139 | 195 |
| 2008 | 137 | 170 |
| 2009 | 117 | 137 |
| 2010 | 161 | 168 |
| 2011 | 123 | 128 |
| 2012 | 118 | 154 |
| 2013 | 138 | 167 |
| 2014 | 176 | 158 |
| 2015 | 174 | 147 |
| 2016 | 140 | 134 |
| 2017 | 129 | 102 |
| 2018 | 125 | 133 |
| 2019 | 128 | 139 |
| 2020 | 144 | 137 |
| 2021 | 112 | 143 |
| 2022 | 103 | 170 |
| 2023 | 119 | 256 |
| 2024 | 160 | 196 |
| 2025 | 168 | 235 |
| 2026 | 112 | 264 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Replacement electrode process for 3D ferroelectric memory6 Oct 2026US 12,757,407 B2Intel Corporation
- Semiconductor device and method for fabricating the same6 Oct 2026US 12,757,415 B2United Microelectronics Corp.
- Semiconductor device with MIM capacitor and method for manufacturing same29 Sep 2026US 12,751,022 B2Hangzhou Fullsemi Semiconductor Co., Ltd.
- Metal-insulator-metal structures and methods of forming the same29 Sep 2026US 12,751,283 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Resistor structure including charge control layer22 Sep 2026US 12,745,407 B2Texas Instruments Incorporated
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing capacitor and method of manufacturing memory device8 Oct 2026US 2026/0313920 A1EGTM Co., Ltd.
- Decoupling finfet capacitors8 Oct 2026US 2026/0313922 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Capacitor, method of manufacturing capacitor, and method of manufacturing memory device8 Oct 2026US 2026/0313923 A1EGTM Co., Ltd.
- Concentric dtc bumps for high density package decap solution8 Oct 2026US 2026/0313924 A1QUALCOMM Incorporated
Most cited
By later US patents
- Precursor source mixtures666US 6,984,591 B1International Business Machines Corporation · 2006
- Dopant precursors and processes596US 6,743,738 B2ASM America, Inc. · 2004
- Process for manufacturing vertical dynamic random access memories409US 5,106,775 AHitachi, Ltd. · 1992
- Capacitor structure for an integrated circuit396US 5,583,359 ANorthern Telecom Limited · 1996
- Semiconductor device and method of manufacturing the same372US 6,737,716 B1Kabushiki Kaisha Toshiba · 2004