H10D 1/041
Of capacitors having no potential barriers
Official title: {of capacitors having no potential barriers}
H10D1/041 (Of capacitors having no potential barriers) appears on 3,184 US grants and 3,277 published applications in this corpus.
Search patents in H10D- Granted patents
- 3,184
- Published applications
- 3,277
- Assignees
- 404
- Inventors
- 4,602
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 20 | 0 |
| 1993 | 18 | 0 |
| 1994 | 13 | 0 |
| 1995 | 20 | 0 |
| 1996 | 33 | 0 |
| 1997 | 28 | 0 |
| 1998 | 54 | 0 |
| 1999 | 73 | 0 |
| 2000 | 158 | 0 |
| 2001 | 178 | 70 |
| 2002 | 163 | 165 |
| 2003 | 148 | 145 |
| 2004 | 135 | 152 |
| 2005 | 96 | 146 |
| 2006 | 131 | 200 |
| 2007 | 107 | 137 |
| 2008 | 99 | 116 |
| 2009 | 83 | 91 |
| 2010 | 117 | 118 |
| 2011 | 80 | 89 |
| 2012 | 74 | 102 |
| 2013 | 92 | 118 |
| 2014 | 112 | 91 |
| 2015 | 114 | 86 |
| 2016 | 82 | 78 |
| 2017 | 71 | 61 |
| 2018 | 70 | 86 |
| 2019 | 87 | 98 |
| 2020 | 99 | 108 |
| 2021 | 80 | 107 |
| 2022 | 82 | 138 |
| 2023 | 93 | 220 |
| 2024 | 136 | 160 |
| 2025 | 140 | 185 |
| 2026 | 91 | 210 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Replacement electrode process for 3D ferroelectric memory6 Oct 2026US 12,757,407 B2Intel Corporation
- Semiconductor device with MIM capacitor and method for manufacturing same29 Sep 2026US 12,751,022 B2Hangzhou Fullsemi Semiconductor Co., Ltd.
- Metal-insulator-metal structures and methods of forming the same29 Sep 2026US 12,751,283 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Logic device and manufacturing method thereof22 Sep 2026US 12,745,408 B2Samsung Electronics Co., Ltd.
- Semiconductor component with metal-insulator-metal capacitor assembly22 Sep 2026US 12,745,627 B2Imec Vzw
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing capacitor and method of manufacturing memory device8 Oct 2026US 2026/0313920 A1EGTM Co., Ltd.
- Capacitor, method of manufacturing capacitor, and method of manufacturing memory device8 Oct 2026US 2026/0313923 A1EGTM Co., Ltd.
- Concentric dtc bumps for high density package decap solution8 Oct 2026US 2026/0313924 A1QUALCOMM Incorporated
- A Multi-Layer Deep-Trench Capacitor8 Oct 2026US 2026/0313925 A1Lotus Microsystems Aps
Most cited
By later US patents
- Capacitor structure for an integrated circuit396US 5,583,359 ANorthern Telecom Limited · 1996
- Method for fabricating a cylinder-type capacitor utilizing a connected ring structure330US 7,910,452 B2Hynix Semiconductor Inc. · 2011
- Reduced mask CMOS process for fabricating stacked capacitor multi-megabit dynamic random access memories utilizing single etch stop layer for contacts248US 5,292,677 AMicron Technology, Inc. · 1994
- Films doped with carbon for use in integrated circuit technology244US 6,462,371 B1Micron Technology, Inc. · 2002
- Method of forming a stacked capacitor with striated electrode231US 5,238,862 AMicron Technology, Inc. · 1993