H05K 2201/10431
Details of mounted components
H05K2201/10431 (Details of mounted components) appears on 5,027 US grants and 4,994 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,027
- Published applications
- 4,994
- Assignees
- 1,714
- Inventors
- 10,519
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 7 | 0 |
| 1978 | 15 | 0 |
| 1979 | 6 | 0 |
| 1980 | 12 | 0 |
| 1981 | 8 | 0 |
| 1982 | 17 | 0 |
| 1983 | 12 | 0 |
| 1984 | 18 | 0 |
| 1985 | 26 | 0 |
| 1986 | 32 | 0 |
| 1987 | 32 | 0 |
| 1988 | 34 | 0 |
| 1989 | 40 | 0 |
| 1990 | 50 | 0 |
| 1991 | 59 | 0 |
| 1992 | 59 | 0 |
| 1993 | 40 | 0 |
| 1994 | 45 | 0 |
| 1995 | 51 | 0 |
| 1996 | 48 | 0 |
| 1997 | 57 | 0 |
| 1998 | 74 | 0 |
| 1999 | 81 | 0 |
| 2000 | 90 | 0 |
| 2001 | 95 | 41 |
| 2002 | 108 | 150 |
| 2003 | 130 | 151 |
| 2004 | 125 | 161 |
| 2005 | 114 | 188 |
| 2006 | 143 | 246 |
| 2007 | 135 | 258 |
| 2008 | 152 | 265 |
| 2009 | 156 | 266 |
| 2010 | 201 | 246 |
| 2011 | 177 | 155 |
| 2012 | 168 | 140 |
| 2013 | 139 | 149 |
| 2014 | 129 | 176 |
| 2015 | 145 | 207 |
| 2016 | 151 | 157 |
| 2017 | 179 | 157 |
| 2018 | 164 | 250 |
| 2019 | 249 | 270 |
| 2020 | 279 | 292 |
| 2021 | 237 | 218 |
| 2022 | 191 | 172 |
| 2023 | 154 | 202 |
| 2024 | 150 | 184 |
| 2025 | 150 | 158 |
| 2026 | 87 | 135 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/10507Involving several componentsIndexing code2,481
- H05K 2201/10439Position of a single componentIndexing code1,182
- H05K 2201/1059Connections made by press-fit insertionIndexing code504
- H05K 2201/10598Means for fastening a component, a casing or a heat sink wherebyIndexing code441
- H05K 2201/10568Integral adaptations of a component or an auxiliary pcb for mountingIndexing code326
- H05K 2201/10606Permanent holder for component or auxiliary printed circuits mounted on a printedIndexing code205
- H05K 2201/1056Metal over component, i.e. metal plate over component mounted on or embeddedIndexing code195
- H05K 2201/10583Cylindrically shaped componentIndexing code98
Recent patents
- Surge suppression device29 Sep 2026US 12,749,890 B2Proterial, Ltd.
- Electrical equipment22 Sep 2026US 12,745,351 B2Valeo Electrification
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Spring bracket and sensor device including same8 Sep 2026US 12,733,102 B2Johnson Controls Fire Protection LP
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
Most cited
By later US patents
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems424US 5,663,901 ASanDisk Corporation · 1997
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991