H05K 2201/10568
Integral adaptations of a component or an auxiliary pcb for mounting
Official title: Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
H05K2201/10568 (Integral adaptations of a component or an auxiliary pcb for mounting) appears on 326 US grants and 177 published applications in this corpus.
Search patents in H05K- Granted patents
- 326
- Published applications
- 177
- Assignees
- 191
- Inventors
- 651
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 9 | 0 |
| 1988 | 6 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 4 | 0 |
| 1993 | 8 | 0 |
| 1994 | 11 | 0 |
| 1995 | 12 | 0 |
| 1996 | 11 | 0 |
| 1997 | 13 | 0 |
| 1998 | 12 | 0 |
| 1999 | 18 | 0 |
| 2000 | 15 | 0 |
| 2001 | 15 | 8 |
| 2002 | 10 | 11 |
| 2003 | 11 | 19 |
| 2004 | 15 | 16 |
| 2005 | 13 | 10 |
| 2006 | 10 | 11 |
| 2007 | 8 | 10 |
| 2008 | 3 | 6 |
| 2009 | 5 | 10 |
| 2010 | 5 | 4 |
| 2011 | 2 | 2 |
| 2012 | 2 | 1 |
| 2013 | 2 | 3 |
| 2014 | 3 | 5 |
| 2015 | 1 | 2 |
| 2016 | 3 | 2 |
| 2017 | 4 | 5 |
| 2018 | 5 | 10 |
| 2019 | 8 | 4 |
| 2020 | 9 | 9 |
| 2021 | 6 | 9 |
| 2022 | 6 | 3 |
| 2023 | 6 | 9 |
| 2024 | 6 | 2 |
| 2025 | 2 | 6 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board with a contact point7 Apr 2026US 12,597,750 B2KNORR-BREMSE Systeme fuer Nutzfahrzeuge GmbH
- Adapter card and graphics card test device29 Jul 2025US 12,373,009 B2Fulian Precision Electronics (Tianjin) Co., LTD.
- Inductors including electrically conductive standoffs14 Jan 2025US 12,198,844 B2Maxim Integrated Products, Inc.
- Chip packaged battery26 Nov 2024US 12,156,338 B2The Johns Hopkins University
- Embedded voltage multiplier for an x-ray source19 Nov 2024US 12,150,232 B2Moxtek, Inc.
- LED Lamp with Four-wire Double-sided PCB3 Jul 2025US 2025/0216058 A1Shangyou Jiayi Lighting Product Co., Ltd.
- Component embedded in mold material for mitigating thickness mismatch with core3 Jul 2025US 2025/0220819 A1Intel Corporation
- Chip electronic component12 Jun 2025US 2025/0191845 A1Murata Manufacturing Co., Ltd.
- Delivery of power to a chip through a daughter board using connective electrical components5 Jun 2025US 2025/0185169 A1Arista Networks, Inc.
- Inductors including electrically conductive standoffs20 Mar 2025US 2025/0095904 A1Maxim Integrated Products, Inc.
Most cited
By later US patents
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Pad array carrier IC device using flexible tape207US 5,045,921 AMotorola, Inc. · 1991
- Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer201US 5,673,479 ALSI Logic Corporation · 1997
- Surface mount semiconductor package197US 6,204,554 B1International Rectifier Corporation · 2001
- Integrated circuit package including lead frame with electrically isolated alignment feature184US 6,246,108 B1Micron Technology, Inc. · 2001