Chip electronic component

A chip electronic component comprising:

• a multilayer ceramic capacitor;
• and
• spacers;
• wherein
• the multilayer ceramic capacitor includes:
• a multilayer body including a plurality of inner electrode layers and a plurality of inner dielectric layers that are alternately arranged;
• and
• outer electrodes;
• the multilayer body includes:
• capacitor principal surfaces opposite to each other in a lamination direction;
• capacitor side surfaces opposite to each other in a width direction that crosses the lamination direction;
• and
• capacitor end surfaces opposite to each other in a length direction that crosses the lamination direction and the width direction;
• and
• the outer electrodes are provided on respective ones of the capacitor end surfaces;
• the spacers are provided at both ends of one of the capacitor principal surfaces in the length direction, the one of the capacitor principal surfaces being adjacent to a mounting board for the multilayer ceramic capacitor;
• and
• each of the spacers includes spacer principal surfaces opposite to each other in the lamination direction, and at least one recess is provided in a surface of one of the spacer principal surfaces that is adjacent to the mounting board.