H05K 2201/10553
Component over metal, i.e. metal plate in between bottom of component and
Official title: Component over metal, i.e. metal plate in between bottom of component and surface of PCB
H05K2201/10553 (Component over metal, i.e. metal plate in between bottom of component and) appears on 76 US grants and 85 published applications in this corpus.
Search patents in H05K- Granted patents
- 76
- Published applications
- 85
- Assignees
- 69
- Inventors
- 209
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 4 |
| 2005 | 0 | 1 |
| 2006 | 2 | 7 |
| 2007 | 1 | 3 |
| 2008 | 2 | 4 |
| 2009 | 3 | 7 |
| 2010 | 1 | 2 |
| 2011 | 9 | 3 |
| 2012 | 1 | 1 |
| 2013 | 2 | 0 |
| 2014 | 0 | 9 |
| 2015 | 4 | 5 |
| 2016 | 2 | 2 |
| 2017 | 2 | 4 |
| 2018 | 5 | 5 |
| 2019 | 2 | 2 |
| 2020 | 2 | 0 |
| 2021 | 1 | 2 |
| 2022 | 2 | 2 |
| 2023 | 2 | 1 |
| 2024 | 0 | 15 |
| 2025 | 6 | 1 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Circuit, circuit board, and heat sink assembly for retrofitting a lighting system with LED lights21 Apr 2026US 12,610,450 B2
- Self-contained ballast driver for retrofitting a lighting system with LED lights31 Mar 2026US 12,593,393 B2
- Aiming system for retrofitting a lighting system with LED lights25 Nov 2025US 12,480,646 B2
- Wire keeper, and an electrical component enclosure for retrofitting a lighting system with LED lights4 Nov 2025US 12,460,802 B2
- Semiconductor module and insert molding method19 Mar 2026US 2026/0082485 A1Fuji Electric Co., Ltd.
- Electronic device12 Mar 2026US 2026/0075704 A1Pegatron Corporation
- Lens for retrofitting a lighting system with led lights5 Feb 2026US 2026/0036288 A1Musco Corporation
- Led luminaire for retrofitting a lighting system with led lights11 Dec 2025US 2025/0377092 A1Musco Corporation
- Method for retrofitting a lighting system with led lights25 Jul 2024US 2024/0247768 A1Musco Corporation
Most cited
By later US patents
- Heat pipe thermal mounting plate for cooling electronic circuit cards80US 4,118,756 AHughes Aircraft Company · 1978
- Heat-dissipating method and device for led display75US 5,173,839 AGrumman Aerospace Corporation · 1992
- Light emitting diode assembly with low thermal resistance63US 6,501,103 B1Lite-On Electronics, Inc. · 2002
- Packaging arrangement for spacecraft computer53US 4,599,680 ASouthwest Research Institute · 1986
- Fabrication method for printed circuit board50US 4,975,142 AGeneral Electric Company · 1990