H05K 2201/10598
Means for fastening a component, a casing or a heat sink whereby
Official title: Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
H05K2201/10598 (Means for fastening a component, a casing or a heat sink whereby) appears on 441 US grants and 472 published applications in this corpus.
Search patents in H05K- Granted patents
- 441
- Published applications
- 472
- Assignees
- 332
- Inventors
- 1,073
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 9 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 11 | 6 |
| 2002 | 15 | 28 |
| 2003 | 19 | 15 |
| 2004 | 14 | 19 |
| 2005 | 14 | 24 |
| 2006 | 11 | 22 |
| 2007 | 16 | 34 |
| 2008 | 26 | 27 |
| 2009 | 15 | 36 |
| 2010 | 15 | 33 |
| 2011 | 25 | 17 |
| 2012 | 20 | 16 |
| 2013 | 18 | 13 |
| 2014 | 12 | 12 |
| 2015 | 15 | 10 |
| 2016 | 13 | 4 |
| 2017 | 9 | 7 |
| 2018 | 5 | 11 |
| 2019 | 8 | 11 |
| 2020 | 11 | 26 |
| 2021 | 20 | 23 |
| 2022 | 18 | 18 |
| 2023 | 14 | 12 |
| 2024 | 14 | 17 |
| 2025 | 7 | 18 |
| 2026 | 6 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Connector18 Aug 2026US 12,713,515 B2Suzhou Metabrain Intelligent Technology Co., Ltd.
- Lever actuated locking mechanism18 Aug 2026US 12,713,534 B2Eaton Intelligent Power Limited
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Self-equalizing frame for thermal management device preload16 Jun 2026US 12,660,143 B2Cisco Technology, Inc.
- Circuit board and manufacturing method thereof21 Apr 2026US 12,610,454 B2Boardtek Electronics Corporation
- Thermal cooling solutions for variable height devices in an optical modem clamshell assembly1 Oct 2026US 2026/0304592 A1Ciena Corporation
- Heat dissipation module, assembling method thereof and electronic device having the same10 Sep 2026US 2026/0271176 A1Delta Electronics, Inc.
- Fastener system13 Aug 2026US 2026/0235151 A1Tesla, Inc.
- Heat dissipation device and electronic device6 Aug 2026US 2026/0231317 A1AAC Microtech (Changzhou) Co., Ltd.
- Semiconductor device and manufacturing method thereof6 Aug 2026US 2026/0231334 A1Mediatek Inc.
Most cited
By later US patents
- Mounting arrangement for light emitting diodes214US 6,712,486 B1Permlight Products, Inc. · 2004
- Inter-circuit encapsulated packaging132US 6,304,450 B1INCEP Technologies, Inc. · 2001
- Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article124US 6,729,025 B2Foster-Miller, Inc. · 2004
- Mounting arrangement for light emitting diodes124US 7,306,353 B2Permlight Products, Inc. · 2007
- LED mounting system117US 6,582,100 B1Relume Corporation · 2003