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US 2026/0231334 A1Published application
Semiconductor device and manufacturing method thereof
AssigneeMediatek Inc.
InventorsYu-Tao Yang, Chih-Ming Hung
Life of this patent
Estimating the term…
Abstract
A semiconductor device is provided. The semiconductor device includes a first circuit board, a first semiconductor chip assembly, a first cooling unit and a first supporting component. The first circuit board has a first surface. The first semiconductor chip assembly is disposed on the first surface of the first circuit board. The first supporting component connects the first cooling unit with the first circuit board in a thickness direction of the semiconductor device.
Claims20
A semiconductor device, comprising:
- a first circuit board having a first surface;
- a first semiconductor chip assembly disposed on the first surface of the first circuit board;
- a first cooling unit;
- a first supporting component connecting the first cooling unit with the first circuit board in a thickness direction of the semiconductor device.
1 more element
A manufacturing method for a semiconductor device, comprising:
- disposing a first semiconductor chip assembly on a first surface of a first circuit board;
- and
- disposing a first supporting component to connect the first cooling unit with the first circuit board in a thickness direction of the semiconductor device.
Dependencies are inferred from the claim text.