US 12,610,454 B2Granted

Circuit board and manufacturing method thereof

AssigneeBoardtek Electronics Corporation

InventorChung-Hsing Liao

Life of this patent

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Abstract

A circuit board includes a first external wiring layer, a second external wiring layer, a first internal structure, and a second internal structure. The first internal structure and the second internal structure are disposed between the first external wiring layer and the second external wiring layer. The first internal structure includes a first metal block extending from the first external wiring layer to the second internal structure. The second internal structure includes a second metal block, a high-frequency substrate, and a first conductive material. The second metal block penetrates through the high-frequency substrate. The first conductive material is disposed on the first metal block, in which the second metal block extends from the second external wiring layer to the first conductive material, and the first conductive material electrically connects the first metal block and the second metal block.

Claims15

Dependent claims

A circuit board, comprising:

a first external wiring layer;
a second external wiring layer;
a first internal structure;
and
a second internal structure, wherein the first internal structure and the second internal structure are disposed between the first external wiring layer and the second external wiring layer, the first internal structure is disposed between the first external wiring layer and the second internal structure, and the second internal structure is disposed between the first internal structure and the second external wiring layer;
wherein the first internal structure comprises:
a first metal block, wherein the first metal block extends from the first external wiring layer to the second internal structure;
wherein the second internal structure comprises:
a second metal block;
a high-frequency substrate, wherein the second metal block penetrates through the high-frequency substrate, wherein the high-frequency substrate comprises:
a top wiring layer;
a bottom wiring layer;
and
a substrate body disposed between the top wiring layer and the bottom wiring layer;
and
a first conductive material disposed on the first metal block, wherein the second metal block extends from the second external wiring layer to the first conductive material, and the first conductive material electrically connects the first metal block and the second metal block.

13 more elements

A manufacturing method of a circuit board, comprising:

providing a first wiring substrate, wherein the first wiring substrate comprises a first external metal layer and a first groove;
providing a first metal block, wherein a width of the first metal block is less than a width of the first groove;
disposing the first metal block in the first groove;
providing a second wiring substrate, wherein the second wiring substrate comprises a second external metal layer and a second groove;
providing a high-frequency substrate, wherein a width of the high-frequency substrate is less than a width of the second groove;
disposing the high-frequency substrate in the second groove;
fixing the first wiring substrate, the high-frequency substrate and the second wiring substrate together through a rivet;
removing a portion of the high-frequency substrate and a portion of the second wiring substrate to form a third groove, wherein the third groove exposes a portion of a top surface of the first metal block;
disposing a first conductive material at a bottom of the third groove;
providing a second metal block, wherein a width of the second metal block is less than a width of the third groove, and the width of the second metal block is less than the width of the first metal block;
disposing the second metal block in the third groove;
disposing a first filling material around the second metal block;
after disposing the second metal block in the third groove, forming a plurality of plated through-holes in the first wiring substrate and the second wiring substrate;
forming a first external wiring layer by using the first external metal layer;
and
forming a second external wiring layer by using the second external metal layer.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/642,147Filed 22 Apr 2024
Published: US 2025/0331100 A123 Oct 2025
Granted: 21 Apr 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H05K 1/0204
Cooling of mounted components: using means for thermal conduction connection in the thickness direction of the substrate
H05K 1/0243
High frequency adaptations: printed circuits associated with mounted high frequency components
H05K 3/1216
Using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or…
H05K 3/429
Plated through-holes or plated via connections: plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit…