Heat dissipation module, assembling method thereof and electronic device having the same

An assembling method of a heat dissipation module, comprising:

• a pre-assembling step (a), comprising providing a circuit board and a fixing seat, the circuit board comprising a heat source, the fixing seat comprising a plurality of first latches, arranging the fixing seat on the circuit board to locate the heat source at or adjacent to a center of the fixing seat;
• a first assembling step (c), comprising providing a combination frame and a heat dissipator, the combination frame comprising a limiting structure and a plurality of second latches, assembling the combination frame with one of the fixing seat and the heat dissipator into a semi-assembly;
• and
• a second assembling step (d), comprising assembling another of the fixing seat and the heat dissipator with the semi-assembly, respectively snapping the second latches on the first latches to fix the combination frame on the fixing seat, and meanwhile limiting at least a portion of the heat dissipator by the limiting structure to attach the heat dissipator on the heat source.

An electronic device, comprising:

• a housing;
• a circuit board, arranged in the housing, the circuit board comprising a heat source;
• a fixing seat, arranged on the circuit board to locate the heat source at or adjacent to a center of the fixing seat, the fixing seat comprising a first latch;
• a combination frame, comprising a limiting structure and a plurality of second latches, and the second latches respectively snapping on the first latches to fix the combination frame on the fixing seat;
• and
• a heat dissipator, limited by the limiting structure, at least a portion of the heat dissipator limited in the combination frame so that the heat dissipator is attached to the heat source along a vertical direction.